10CL040YF484C8G

IC FPGA 325 I/O 484FBGA
Part Description

Cyclone® 10 LP Field Programmable Gate Array (FPGA) IC 325 1161216 39600 484-BGA

Quantity 762 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BGANumber of I/O325Voltage1.2 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2475Number of Logic Elements/Cells39600
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits1161216

Overview of 10CL040YF484C8G – Cyclone® 10 LP FPGA, 39,600 logic elements, 484‑BGA

The 10CL040YF484C8G is a Cyclone® 10 LP Field Programmable Gate Array (FPGA) in a 484‑ball FBGA (23×23) package. This commercial‑grade FPGA provides 39,600 logic elements, 1,161,216 total RAM bits, and 325 user I/O pins in a compact surface‑mount package.

With a 1.2 V core supply and an operating temperature range of 0 °C to 85 °C, this device is suited to commercial embedded designs that require sizable programmable logic, on‑chip memory, and a high I/O count in a space‑efficient package.

Key Features

  • Core Logic  39,600 logic elements provide substantial capacity for implementing custom digital logic, signal processing, and control functions.
  • On‑Chip Memory  1,161,216 total RAM bits support large buffering, FIFOs, and local storage for latency‑sensitive designs.
  • I/O Density  325 user I/O pins enable extensive peripheral connectivity and parallel interfaces in a single device.
  • Package & Mounting  484‑FBGA (23×23) package in a surface‑mount footprint balances I/O density with board‑level integration.
  • Power  Standard core supply at 1.2 V simplifies power rail planning for systems designed around Cyclone® 10 LP devices.
  • Commercial Temperature Grade  Rated for 0 °C to 85 °C operating temperature to meet typical commercial electronics requirements.
  • RoHS Compliant  Manufactured to meet RoHS environmental standards.

Typical Applications

  • Commercial Embedded Systems  Programmable logic and abundant I/O for control, interfacing, and protocol bridging in general commercial electronics.
  • Industrial Automation (Commercial‑grade)  Customizable logic and on‑chip RAM for control algorithms and data buffering in commercial industrial equipment.
  • Communications Peripherals  High I/O count and on‑chip memory support parallel and serial interface handling in communication modules.
  • Consumer Electronics  Flexible implementation of custom features and peripherals where a commercial temperature grade is appropriate.

Unique Advantages

  • High Logic Capacity: 39,600 logic elements enable complex custom logic implementations without immediate need for multi‑chip solutions.
  • Significant On‑Chip Memory: Over 1.16 million RAM bits reduce external memory dependence for buffering and data processing.
  • Extensive I/O: 325 I/O pins provide flexibility for connecting multiple peripherals, sensors, and interfaces directly to the FPGA.
  • Compact, High‑Density Package: 484‑FBGA (23×23) delivers high I/O and logic density in a space‑efficient surface‑mount footprint.
  • Commercial Temperature and RoHS Compliance: Designed for commercial environments with standard temperature range and environmental compliance.

Why Choose 10CL040YF484C8G?

The 10CL040YF484C8G positions itself as a practical choice for engineers who need a commercial‑grade, mid‑to‑high capacity FPGA with significant on‑chip memory and high I/O density in a compact package. Its 1.2 V core supply and 0 °C to 85 °C operating range make it suitable for a wide range of commercial embedded applications where integration and board‑level space efficiency matter.

Choosing this Cyclone® 10 LP device can simplify system architecture by consolidating logic, buffering, and interface requirements into a single, RoHS‑compliant FPGA package—helping reduce BOM complexity while retaining design flexibility.

Request a quote or submit an inquiry for 10CL040YF484C8G to receive pricing and availability information tailored to your project needs.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up