5AGTFD3H3F40I5N

IC FPGA 704 I/O 1517FBGA
Part Description

Arria V GT Field Programmable Gate Array (FPGA) IC 704 19822592 362000 1517-BBGA

Quantity 934 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1517-FBGA (40x40)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1517-BBGANumber of I/O704Voltage1.07 V - 1.13 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs17110Number of Logic Elements/Cells362000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits19822592

Overview of 5AGTFD3H3F40I5N – Arria V GT Field Programmable Gate Array (FPGA), 362000 logic elements, 704 I/O

The 5AGTFD3H3F40I5N is an Intel Arria V GT FPGA in a 1517-BBGA package designed for industrial-grade applications. It combines 362000 logic elements with 19,822,592 bits of on-chip RAM and 704 user I/O pins, delivering a high-density programmable fabric suitable for complex, high‑I/O designs.

Key platform-level electrical characteristics include a core supply range of 1.07 V to 1.13 V and an operating temperature range of −40 °C to 100 °C. The device is supplied in a surface-mount 1517 package and is RoHS compliant.

Key Features

  • Logic Capacity — 362000 logic elements provide substantial programmable resources for large-scale digital designs.
  • On-chip Memory — 19,822,592 total RAM bits enable data buffering, lookup tables, and memory-intensive functions without immediate external memory dependency.
  • I/O Density — 704 user I/O pins support high‑channel-count interfaces and dense external connectivity.
  • Power and Core Supply — Specified core voltage range from 1.07 V to 1.13 V for precise power planning and regulator selection.
  • Package & Mounting — 1517-BBGA package (supplier device package: 1517-FBGA 40×40) in a surface-mount form factor for compact PCB integration.
  • Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C to meet industrial environment requirements.
  • Regulatory — RoHS compliant.

Typical Applications

  • High-density interface bridging — 704 I/O pins make the device suitable for implementing multi‑lane protocol bridges and complex peripheral interfaces.
  • Data buffering and packet processing — Large on-chip RAM capacity supports packet buffering and intermediate processing for communication systems.
  • Industrial control and automation — Industrial temperature rating and broad I/O complement control logic, sensor aggregation, and motion-control front-ends.
  • Prototyping and system integration — Extensive logic element count enables implementation of large FPGA prototypes and subsystem integration on a single device.

Unique Advantages

  • High programmable density: 362000 logic elements permit consolidation of complex functions into a single FPGA, reducing board-level partitioning.
  • Substantial embedded RAM: Nearly 20 million bits of on-chip RAM reduce dependency on external memory for many buffering and lookup tasks.
  • Exceptional I/O capability: 704 I/O pins provide flexibility for high-pin-count designs and multiple simultaneous interfaces.
  • Industrial thermal range: −40 °C to 100 °C operation supports deployment in demanding environmental conditions.
  • Compact BGA packaging: 1517-BBGA / 1517-FBGA (40×40) packaging enables dense board layouts while supporting surface-mount assembly flows.
  • Controlled core voltage window: Narrow supply range (1.07 V–1.13 V) simplifies power-supply selection and enables predictable core performance planning.

Why Choose 5AGTFD3H3F40I5N?

The 5AGTFD3H3F40I5N Arria V GT FPGA targets designs that require a balance of high logic density, ample on‑chip memory, and large I/O counts in an industrial-grade package. Its defined core supply range and wide operating temperature window make it suitable for designs where electrical and thermal predictability matter.

This device suits engineering teams building complex interface logic, data-processing pipelines, or consolidated subsystems that benefit from integrated programmable resources and high I/O connectivity. RoHS compliance and a compact BGA package support modern manufacturing and assembly processes.

Request a quote or submit a product inquiry to get pricing, availability, and technical support information for 5AGTFD3H3F40I5N.

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