5AGTFD7H3F35I5N
| Part Description |
Arria V GT Field Programmable Gate Array (FPGA) IC 544 27695104 504000 1152-BBGA, FCBGA Exposed Pad |
|---|---|
| Quantity | 219 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA Exposed Pad | Number of I/O | 544 | Voltage | 1.07 V - 1.13 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 23780 | Number of Logic Elements/Cells | 504000 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 27695104 |
Overview of 5AGTFD7H3F35I5N – Arria V GT Field Programmable Gate Array (FPGA), 504,000 logic elements, 544 I/Os
The 5AGTFD7H3F35I5N is an Intel Arria V GT FPGA offering a high-density programmable logic fabric with 504,000 logic elements and 27,695,104 total RAM bits. It is shipped in a 1152-BBGA FCBGA exposed-pad package and supports 544 user I/Os for I/O-rich board designs.
Designed for industrial-grade applications, this surface-mount FPGA operates from a core voltage of 1.07 V to 1.13 V and an ambient temperature range of −40 °C to 100 °C, providing a combination of integration density, on-chip memory, and robust temperature capability suitable for demanding embedded systems.
Key Features
- Core Logic 504,000 logic elements (cells) provide substantial programmable logic capacity for complex digital designs.
- On-chip Memory 27,695,104 total RAM bits available for buffering, FIFOs, and local storage to support memory-intensive functions.
- I/O Density 544 user I/Os enable extensive peripheral interfacing and high pin-count connectivity for board-level integration.
- Power and Supply Core voltage specified at 1.07 V to 1.13 V for predictable supply planning and power budgeting.
- Package & Mounting 1152-BBGA (1152-FBGA, 35×35) FCBGA with exposed pad; surface-mount package suitable for high-density PCB layouts and board-level thermal interface.
- Industrial Temperature Rated for operation from −40 °C to 100 °C to meet industrial-environment thermal requirements.
- Regulatory Compliance RoHS compliant.
Typical Applications
- High-density logic integration Use where large amounts of programmable logic (504,000 logic elements) are required to implement complex state machines, datapaths, or hardware accelerators.
- Memory-intensive designs Systems that need substantial on-chip RAM (27,695,104 bits) for buffering, packet storage, or caching.
- I/O-rich system interfaces Applications demanding many external connections can leverage the 544 user I/Os for peripheral, sensor, or multi-lane interfaces.
- Industrial embedded systems Deployments that require extended temperature operation (−40 °C to 100 °C) and surface-mount packaging for rugged board assemblies.
Unique Advantages
- Large programmable fabric: 504,000 logic elements enable consolidation of multiple functions into a single device, reducing system BOM and board area.
- Significant on-chip memory: 27,695,104 total RAM bits support high-throughput buffering and local data processing without immediate reliance on external memory.
- Extensive I/O capability: 544 I/Os provide flexible connectivity options for dense peripheral and subsystem interfacing.
- Industrial operating range: Rated −40 °C to 100 °C to support deployment in thermally challenging environments.
- Board-level thermal & mounting convenience: 1152-BBGA FCBGA with exposed pad and surface-mount package simplifies PCB integration and thermal path planning.
- Standards-friendly compliance: RoHS compliance helps simplify regulatory considerations for manufactured products.
Why Choose 5AGTFD7H3F35I5N?
The 5AGTFD7H3F35I5N Arria V GT FPGA combines a large logic capacity, substantial on-chip memory, and a high I/O count in an industrial-temperature, surface-mount FCBGA package. It is well suited to designs that require consolidating complex logic, buffering large data streams, and supporting many external interfaces while maintaining operation across a wide temperature range.
As a member of the Intel Arria V family, this device provides predictable supply requirements and package options that help streamline board-level design and thermal planning for industrial embedded systems and other high-density FPGA applications.
Request a quote or submit a pricing and availability inquiry to evaluate the 5AGTFD7H3F35I5N for your next design.

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