5AGTFD7H3F35I5N

IC FPGA 544 I/O 1152FBGA
Part Description

Arria V GT Field Programmable Gate Array (FPGA) IC 544 27695104 504000 1152-BBGA, FCBGA Exposed Pad

Quantity 219 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1152-BBGA, FCBGA Exposed PadNumber of I/O544Voltage1.07 V - 1.13 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs23780Number of Logic Elements/Cells504000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits27695104

Overview of 5AGTFD7H3F35I5N – Arria V GT Field Programmable Gate Array (FPGA), 504,000 logic elements, 544 I/Os

The 5AGTFD7H3F35I5N is an Intel Arria V GT FPGA offering a high-density programmable logic fabric with 504,000 logic elements and 27,695,104 total RAM bits. It is shipped in a 1152-BBGA FCBGA exposed-pad package and supports 544 user I/Os for I/O-rich board designs.

Designed for industrial-grade applications, this surface-mount FPGA operates from a core voltage of 1.07 V to 1.13 V and an ambient temperature range of −40 °C to 100 °C, providing a combination of integration density, on-chip memory, and robust temperature capability suitable for demanding embedded systems.

Key Features

  • Core Logic  504,000 logic elements (cells) provide substantial programmable logic capacity for complex digital designs.
  • On-chip Memory  27,695,104 total RAM bits available for buffering, FIFOs, and local storage to support memory-intensive functions.
  • I/O Density  544 user I/Os enable extensive peripheral interfacing and high pin-count connectivity for board-level integration.
  • Power and Supply  Core voltage specified at 1.07 V to 1.13 V for predictable supply planning and power budgeting.
  • Package & Mounting  1152-BBGA (1152-FBGA, 35×35) FCBGA with exposed pad; surface-mount package suitable for high-density PCB layouts and board-level thermal interface.
  • Industrial Temperature  Rated for operation from −40 °C to 100 °C to meet industrial-environment thermal requirements.
  • Regulatory Compliance  RoHS compliant.

Typical Applications

  • High-density logic integration  Use where large amounts of programmable logic (504,000 logic elements) are required to implement complex state machines, datapaths, or hardware accelerators.
  • Memory-intensive designs  Systems that need substantial on-chip RAM (27,695,104 bits) for buffering, packet storage, or caching.
  • I/O-rich system interfaces  Applications demanding many external connections can leverage the 544 user I/Os for peripheral, sensor, or multi-lane interfaces.
  • Industrial embedded systems  Deployments that require extended temperature operation (−40 °C to 100 °C) and surface-mount packaging for rugged board assemblies.

Unique Advantages

  • Large programmable fabric: 504,000 logic elements enable consolidation of multiple functions into a single device, reducing system BOM and board area.
  • Significant on-chip memory: 27,695,104 total RAM bits support high-throughput buffering and local data processing without immediate reliance on external memory.
  • Extensive I/O capability: 544 I/Os provide flexible connectivity options for dense peripheral and subsystem interfacing.
  • Industrial operating range: Rated −40 °C to 100 °C to support deployment in thermally challenging environments.
  • Board-level thermal & mounting convenience: 1152-BBGA FCBGA with exposed pad and surface-mount package simplifies PCB integration and thermal path planning.
  • Standards-friendly compliance: RoHS compliance helps simplify regulatory considerations for manufactured products.

Why Choose 5AGTFD7H3F35I5N?

The 5AGTFD7H3F35I5N Arria V GT FPGA combines a large logic capacity, substantial on-chip memory, and a high I/O count in an industrial-temperature, surface-mount FCBGA package. It is well suited to designs that require consolidating complex logic, buffering large data streams, and supporting many external interfaces while maintaining operation across a wide temperature range.

As a member of the Intel Arria V family, this device provides predictable supply requirements and package options that help streamline board-level design and thermal planning for industrial embedded systems and other high-density FPGA applications.

Request a quote or submit a pricing and availability inquiry to evaluate the 5AGTFD7H3F35I5N for your next design.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up