5AGTFD7H3F35I3G
| Part Description |
Arria V GT Field Programmable Gate Array (FPGA) IC 342 27695104 504000 1152-BBGA, FCBGA |
|---|---|
| Quantity | 87 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA, FC (35x35) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 342 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 23773 | Number of Logic Elements/Cells | 504000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 27695104 |
Overview of 5AGTFD7H3F35I3G – Arria V GT FPGA, 1152‑BBGA (FCBGA), Industrial
The 5AGTFD7H3F35I3G is an Intel Arria V GT field‑programmable gate array supplied in a 1152‑ball BGA (FCBGA) package. It delivers large programmable logic capacity and on‑chip RAM to support complex, high‑density digital designs.
With 504,000 logic elements, 27,695,104 total RAM bits, and 342 I/O, this industrial‑grade device targets designs that require substantial logic resources, significant embedded memory, and broad peripheral connectivity while operating across a wide temperature range.
Key Features
- Core Logic — 504,000 logic elements provide the programmable fabric for complex digital functions and custom accelerators.
- On‑chip Memory — 27,695,104 total RAM bits support large buffering, lookup tables, and state storage without external memory for many use cases.
- I/O Capacity — 342 I/O pins accommodate extensive peripheral and interface connectivity for multi‑device systems.
- Package & Mounting — 1152‑BBGA (FCBGA) package, supplier device package listed as 1152‑FBGA, FC (35×35), designed for surface‑mount assembly.
- Power Supply — Core supply range specified at 820 mV to 880 mV, enabling designers to plan power delivery and regulation precisely.
- Industrial Temperature Range — Rated for operation from −40 °C to 100 °C for deployments in demanding environments.
- Compliance — RoHS‑compliant to meet environmental and regulatory requirements.
Typical Applications
- High‑density digital processing — Implement large custom logic blocks and accelerators using the 504,000 logic elements and extensive on‑chip RAM.
- Data buffering and packet handling — On‑chip RAM capacity supports significant packet or data buffering for network and data‑flow functions.
- Multi‑interface integration — 342 I/O pins simplify direct connections to multiple peripherals, sensors, or daughter cards in complex systems.
- Industrial control and automation — Industrial temperature rating and surface‑mount packaging suit embedded controllers and factory systems requiring robust operation.
Unique Advantages
- Large programmable fabric: 504,000 logic elements enable consolidation of multiple functions onto a single device, reducing board complexity.
- Substantial embedded memory: 27.7Mbits of RAM reduce reliance on external memory for many buffering and LUT requirements, simplifying BOM and layout.
- High I/O count: 342 I/O pins allow flexible system partitioning and direct interfacing to diverse peripherals without extra bridge logic.
- Industrial thermal capability: −40 °C to 100 °C operating range supports deployment in temperature‑challenging environments.
- Precise power specification: Defined core supply window (820–880 mV) enables predictable power‑delivery design and validation.
- RoHS compliant: Meets environmental compliance needs for modern electronics manufacturing.
Why Choose 5AGTFD7H3F35I3G?
The 5AGTFD7H3F35I3G Arria V GT FPGA combines high logic density, significant embedded RAM, and ample I/O in a surface‑mount 1152‑BBGA package engineered for industrial use. It is suited to engineers building complex, integrated digital systems that require predictable power planning and extended temperature operation.
Choose this device for designs that benefit from large on‑chip resources and robust operating margins, enabling consolidation, simplified board design, and long‑term deployment in industrial environments.
Request a quote or submit a procurement inquiry to evaluate 5AGTFD7H3F35I3G for your next design.

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