5AGTMC3D3F27I3N

The 5AGTMC3D3F27I3N is an Intel Arria V GT Field Programmable Gate Array (FPGA) supplied in a 672-BBGA (672-FBGA, 27×27) surface-mount package. The device delivers a large programmable fabric with 156,000 logic elements and 11,746,304 bits of on-chip RAM, paired with 336 I/O pins for high-density interfacing.

Rated for industrial operation, this FPGA supports a core supply range of 1.12 V to 1.18 V and an operating temperature range of −40°C to 100°C. The device is RoHS compliant and intended for designs that require significant logic capacity and integrated memory in a compact BGA footprint.

Key Features

• Core & logic capacity  156,000 logic elements provide substantial programmable resources for complex logic implementations.
• On-chip memory  11,746,304 total RAM bits enable buffering, packet processing, and local data storage without external RAM for many functions.
• High I/O count  336 general-purpose I/O pins accommodate broad interfacing needs to peripherals, transceivers, and board-level buses.
• Power supply  Core voltage supply specified at 1.12 V to 1.18 V, enabling predictable power planning and regulator selection.
• Industrial temperature grade  Operating range from −40°C to 100°C supports deployment in temperature-demanding environments.
• Package and mounting  672-BBGA (672-FBGA, 27×27) surface-mount package for dense board integration in space-constrained designs.
• Compliance  RoHS compliant for regulatory and assembly considerations.

Unique Advantages

• High logic density: 156,000 logic elements allow consolidation of multiple functions into a single FPGA, reducing external component count.
• Substantial on-chip RAM: 11.7 Mbit of embedded RAM supports large buffering, FIFOs, and data-processing blocks without immediate external memory.
• Wide interfacing capability: 336 I/O pins provide flexibility for parallel buses, high-pin-count peripherals, and mixed-signal interfaces.
• Industrial readiness: Rated for −40°C to 100°C operation, making the device suitable for deployments that require extended temperature tolerance.
• Compact BGA footprint: 672-FBGA (27×27) package enables integration into space-constrained PCBs while maintaining high pin count.
• Predictable core power: Defined core voltage range (1.12–1.18 V) simplifies power-supply design and thermal budgeting.

Why Choose 5AGTMC3D3F27I3N?

The 5AGTMC3D3F27I3N Arria V GT FPGA is positioned for designers who need a high-density programmable fabric with substantial on-chip memory and broad I/O capacity in a compact industrial-grade package. The combination of 156,000 logic elements, 11,746,304 RAM bits, and 336 I/Os supports complex digital designs while the specified core voltage and −40°C to 100°C operating range enable robust power and thermal planning.

This device is a strong fit for projects that prioritize integrated logic and memory resources in a surface-mount 672-FBGA package and require RoHS compliance for manufacturing. Its specification set provides a clear basis for system-level tradeoffs around integration, BOM count, and thermal management.

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