5AGTMC3D3F31I3G

The 5AGTMC3D3F31I3G is an Intel Arria V GT field programmable gate array (FPGA) supplied in an 896-ball FCBGA package. This industrial-grade device provides 156,000 logic elements, 11,746,304 total RAM bits, and 416 user I/Os for high-density, reconfigurable logic implementations.

Designed for surface-mount PCB assembly, the device operates from a 1.12 V to 1.18 V core supply and supports an operating temperature range of −40 °C to 100 °C. RoHS compliance is documented for environmental conformity.

Key Features

• Core Logic  156,000 logic elements provide substantial programmable logic capacity for complex digital designs.
• On-Chip Memory  11,746,304 total RAM bits suitable for buffering, packet storage, and other memory-intensive functions.
• I/O Density  416 user I/Os enable extensive external interfacing and signal routing directly from the FPGA.
• Package  896-BBGA (FCBGA) package, supplier package listed as 896-FBGA (31×31), optimized for compact, high-pin-count designs.
• Power  Core supply range of 1.12 V to 1.18 V supports defined low-voltage operation for the FPGA core.
• Temperature & Grade  Industrial grade device with an operating temperature range of −40 °C to 100 °C for designs requiring extended ambient tolerance.
• Mounting  Surface-mount device suitable for automated PCB assembly workflows.
• Environmental Compliance  RoHS compliant for reduced hazardous substances in manufacturing.

Typical Applications

• Industrial and Embedded Systems  The industrial-grade temperature range (−40 °C to 100 °C) and high logic capacity suit embedded control and industrial automation applications.
• High-Density Logic Designs  156,000 logic elements accommodate complex state machines, datapaths, and custom hardware accelerators.
• Memory-Intensive Functions  11,746,304 RAM bits support buffering, packet queues, and on-chip data storage needs.
• I/O-Heavy Interfaces  416 I/Os enable broad external connectivity for multi-channel sensor arrays, protocol bridging, or large peripheral sets.

Unique Advantages

• High Logic Density:  156,000 logic elements allow consolidation of multiple functions into a single programmable device, reducing system component count.
• Substantial On-Chip Memory:  Over 11.7 million RAM bits provide local storage for latency-sensitive data and throughput optimization.
• Extensive I/O Count:  416 I/Os enable flexible partitioning of signals and direct interfacing to numerous peripherals and connectors.
• Industrial Temperature Range:  Rated from −40 °C to 100 °C for deployment in environments with wide temperature variation.
• Compact, High-Pin-Count Package:  896-ball FCBGA (31×31) package delivers high connectivity in a compact form factor for space-constrained boards.
• Defined Core Voltage:  Operates with a core supply between 1.12 V and 1.18 V, enabling predictable power design and supply planning.

Why Choose 5AGTMC3D3F31I3G?

The 5AGTMC3D3F31I3G Arria V GT FPGA combines significant logic capacity, abundant on-chip memory, and a high I/O count in an industrial-grade FCBGA package. Its clear electrical and thermal specifications make it suitable for engineering teams designing robust, reconfigurable hardware where integration density and environmental tolerance matter.

Choose this device when your design demands substantial programmable resources, extensive interfacing, and documented operating conditions for industrial deployments—backed by Intel's Arria V device family specifications.

Request a quote or submit an inquiry to receive pricing and availability for the 5AGTMC3D3F31I3G. Our team can provide part availability, lead-time information, and support for procurement and integration planning.