5AGTMC7G3F31I3G
| Part Description |
Arria V GT Field Programmable Gate Array (FPGA) IC 384 15470592 242000 896-BBGA, FCBGA |
|---|---|
| Quantity | 724 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 896-FBGA (31x31) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 896-BBGA, FCBGA | Number of I/O | 384 | Voltage | 1.12 V - 1.18 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 11460 | Number of Logic Elements/Cells | 242000 | ||
| Number of Gates | N/A | ECCN | PENDING ECCN | HTS Code | 0000.00.0000 | ||
| Qualification | N/A | Total RAM Bits | 15470592 |
Overview of 5AGTMC7G3F31I3G – Arria V GT Field Programmable Gate Array (FPGA), 242,000 logic elements
The 5AGTMC7G3F31I3G is an Intel Arria V GT Field Programmable Gate Array (FPGA) supplied in a high-density 896-ball BGA package. Designed for industrial-grade deployments, this device provides substantial on-chip logic and memory resources with a broad I/O complement for reprogrammable, high-density digital designs.
With 242,000 logic elements, 15,470,592 bits of on-chip RAM and 384 I/O pins, this FPGA targets embedded and industrial systems that require flexible hardware acceleration, large local memory, and a high pin count in a compact surface-mount package.
Key Features
- Core Logic — 242,000 logic elements to implement complex custom logic, state machines, and hardware acceleration.
- On‑Chip Memory — 15,470,592 total RAM bits for buffering, lookup tables and local data storage within the FPGA fabric.
- I/O Density — 384 device I/O pins to support broad peripheral and interface connectivity requirements.
- Package & Mounting — 896-BBGA, FCBGA (supplier package: 896-FBGA, 31 × 31 mm) in a surface-mount format for compact board integration.
- Power — Core voltage supply specified from 1.12 V to 1.18 V for platform power budgeting and regulator selection.
- Thermal & Grade — Industrial-grade device with an operating temperature range of −40 °C to 100 °C for deployment in demanding environments.
- Compliance — RoHS compliant to meet common environmental and manufacturing requirements.
Typical Applications
- Industrial Control & Automation — Use the device’s industrial-grade rating and wide temperature range for reliable control logic, I/O aggregation, and custom sequencing in factory and process automation.
- Embedded Systems & Prototyping — Implement complex algorithms and custom interfaces using abundant logic elements and on-chip memory for rapid prototyping and embedded hardware acceleration.
- Real‑time Signal Processing — Leverage large on-chip RAM and dense logic resources to implement buffering, datapath processing, and deterministic low-latency functions in real-time systems.
Unique Advantages
- High Logic Capacity: 242,000 logic elements permit integration of large, consolidated designs that reduce external components and simplify system architecture.
- Substantial On‑Chip Memory: 15,470,592 RAM bits provide local storage for data buffering, look-up tables and intermediate results, reducing external memory dependence.
- High I/O Count: 384 I/O pins support multiple peripherals and parallel interfaces without extensive external multiplexing.
- Industrial Reliability: Rated for −40 °C to 100 °C operation, enabling deployment in outdoor, industrial and otherwise thermally challenging environments.
- Compact, High‑Density Package: 896-ball BGA (31 × 31 mm) offers a small footprint for board space-constrained designs while delivering high connectivity.
- Predictable Power Envelope: Defined core supply range (1.12 V to 1.18 V) simplifies power-supply design and thermal planning.
Why Choose 5AGTMC7G3F31I3G?
The 5AGTMC7G3F31I3G Arria V GT FPGA delivers a balanced combination of large logic capacity, substantial on‑chip RAM and high I/O density within a compact industrial-grade BGA package. It is well suited to engineers building embedded, industrial or real‑time systems that require reconfigurable hardware resources and reliable operation across a wide temperature range.
Backed by Intel’s Arria V family expertise and documented device specifications, this FPGA provides a scalable platform for reducing BOM complexity, consolidating functions into programmable silicon, and accelerating time-to-market for complex hardware designs.
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