5AGTMC7G3F31I3G

IC FPGA 384 I/O 896FBGA
Part Description

Arria V GT Field Programmable Gate Array (FPGA) IC 384 15470592 242000 896-BBGA, FCBGA

Quantity 724 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package896-FBGA (31x31)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case896-BBGA, FCBGANumber of I/O384Voltage1.12 V - 1.18 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs11460Number of Logic Elements/Cells242000
Number of GatesN/AECCNPENDING ECCNHTS Code0000.00.0000
QualificationN/ATotal RAM Bits15470592

Overview of 5AGTMC7G3F31I3G – Arria V GT Field Programmable Gate Array (FPGA), 242,000 logic elements

The 5AGTMC7G3F31I3G is an Intel Arria V GT Field Programmable Gate Array (FPGA) supplied in a high-density 896-ball BGA package. Designed for industrial-grade deployments, this device provides substantial on-chip logic and memory resources with a broad I/O complement for reprogrammable, high-density digital designs.

With 242,000 logic elements, 15,470,592 bits of on-chip RAM and 384 I/O pins, this FPGA targets embedded and industrial systems that require flexible hardware acceleration, large local memory, and a high pin count in a compact surface-mount package.

Key Features

  • Core Logic — 242,000 logic elements to implement complex custom logic, state machines, and hardware acceleration.
  • On‑Chip Memory — 15,470,592 total RAM bits for buffering, lookup tables and local data storage within the FPGA fabric.
  • I/O Density — 384 device I/O pins to support broad peripheral and interface connectivity requirements.
  • Package & Mounting — 896-BBGA, FCBGA (supplier package: 896-FBGA, 31 × 31 mm) in a surface-mount format for compact board integration.
  • Power — Core voltage supply specified from 1.12 V to 1.18 V for platform power budgeting and regulator selection.
  • Thermal & Grade — Industrial-grade device with an operating temperature range of −40 °C to 100 °C for deployment in demanding environments.
  • Compliance — RoHS compliant to meet common environmental and manufacturing requirements.

Typical Applications

  • Industrial Control & Automation — Use the device’s industrial-grade rating and wide temperature range for reliable control logic, I/O aggregation, and custom sequencing in factory and process automation.
  • Embedded Systems & Prototyping — Implement complex algorithms and custom interfaces using abundant logic elements and on-chip memory for rapid prototyping and embedded hardware acceleration.
  • Real‑time Signal Processing — Leverage large on-chip RAM and dense logic resources to implement buffering, datapath processing, and deterministic low-latency functions in real-time systems.

Unique Advantages

  • High Logic Capacity: 242,000 logic elements permit integration of large, consolidated designs that reduce external components and simplify system architecture.
  • Substantial On‑Chip Memory: 15,470,592 RAM bits provide local storage for data buffering, look-up tables and intermediate results, reducing external memory dependence.
  • High I/O Count: 384 I/O pins support multiple peripherals and parallel interfaces without extensive external multiplexing.
  • Industrial Reliability: Rated for −40 °C to 100 °C operation, enabling deployment in outdoor, industrial and otherwise thermally challenging environments.
  • Compact, High‑Density Package: 896-ball BGA (31 × 31 mm) offers a small footprint for board space-constrained designs while delivering high connectivity.
  • Predictable Power Envelope: Defined core supply range (1.12 V to 1.18 V) simplifies power-supply design and thermal planning.

Why Choose 5AGTMC7G3F31I3G?

The 5AGTMC7G3F31I3G Arria V GT FPGA delivers a balanced combination of large logic capacity, substantial on‑chip RAM and high I/O density within a compact industrial-grade BGA package. It is well suited to engineers building embedded, industrial or real‑time systems that require reconfigurable hardware resources and reliable operation across a wide temperature range.

Backed by Intel’s Arria V family expertise and documented device specifications, this FPGA provides a scalable platform for reducing BOM complexity, consolidating functions into programmable silicon, and accelerating time-to-market for complex hardware designs.

Request a quote or submit a purchase inquiry to obtain pricing, availability and lead-time information for 5AGTMC7G3F31I3G.

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