5AGTMD3G3F31I3G
| Part Description |
Arria V GT Field Programmable Gate Array (FPGA) IC 384 19822592 362000 896-BBGA, FCBGA |
|---|---|
| Quantity | 79 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 896-FBGA (31x31) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 896-BBGA, FCBGA | Number of I/O | 384 | Voltage | 1.12 V - 1.18 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 17110 | Number of Logic Elements/Cells | 362000 | ||
| Number of Gates | N/A | ECCN | PENDING ECCN | HTS Code | 0000.00.0000 | ||
| Qualification | N/A | Total RAM Bits | 19822592 |
Overview of 5AGTMD3G3F31I3G – Arria V GT Field Programmable Gate Array (FPGA) IC, 362,000 Logic Elements
The 5AGTMD3G3F31I3G is an Arria V GT family FPGA from Intel, delivered in a 896-BBGA (896-FBGA, 31×31) surface-mount package. This industrial-grade device integrates a large programmable fabric, significant on-chip RAM, and a high I/O count to address dense logic and system integration requirements.
With 362,000 logic elements, 19,822,592 bits of on-chip RAM and 384 I/Os, the device is suited for designs that require high integration density, broad I/O connectivity and operation across an industrial temperature range.
Key Features
- Core Logic 362,000 logic elements provide a large programmable fabric for complex digital logic and custom hardware acceleration.
- On‑Chip Memory 19,822,592 total RAM bits offer substantial embedded memory for buffering, state storage, and local data processing.
- I/O Capability 384 I/Os enable extensive external device interfacing and flexible system partitioning.
- Package & Mounting 896-BBGA (supplier package noted as 896-FBGA, 31×31) in a surface-mount form factor for dense board-level integration.
- Power Core supply voltage specified at 1.12 V to 1.18 V to define power domain requirements for system design.
- Industrial Temperature Grade Rated for operation from –40°C to 100°C, suitable for industrial-temperature deployments.
- RoHS Compliance RoHS status: Compliant.
Typical Applications
- Industrial Control Systems Use the device’s 362,000 logic elements and 384 I/Os to implement complex control algorithms, sensor aggregation and deterministic I/O handling within industrial environments.
- Data Processing and Acceleration Leverage extensive on-chip RAM (19,822,592 bits) and programmable logic to implement buffering, packet processing or custom data-path accelerators.
- Communications and Networking High I/O density and the Arria V GT device family architecture support integration of protocol handling, interfacing and system-level control in communications equipment.
Unique Advantages
- High Integration Density: 362,000 logic elements and nearly 20 Mbits of RAM reduce external components and consolidate complex logic into a single device.
- Extensive I/O Count: 384 I/Os allow flexible partitioning between peripherals, memory interfaces and board-level signals without immediate need for external I/O expanders.
- Industrial Reliability: Specified operating range of –40°C to 100°C supports deployment in harsh or temperature-variable environments.
- Compact Surface-Mount Package: 896-BBGA (896-FBGA, 31×31) enables board space optimization while supporting large FPGA capacity.
- Controlled Core Power Domain: Defined core supply range (1.12 V to 1.18 V) helps designers plan power delivery and thermal budgets accurately.
- Standards-Ready Supply Compliance: RoHS compliant status simplifies regulatory alignment during product development.
Why Choose 5AGTMD3G3F31I3G?
The 5AGTMD3G3F31I3G Arria V GT FPGA combines a high count of logic elements, substantial embedded RAM and a broad I/O complement in a compact FCBGA package designed for industrial operation. This balance of resources is appropriate for designers who need to consolidate complex functions, reduce board-level BOM and maintain operation across a wide temperature range.
As part of the Arria V device family, this device is supported by published device documentation and electrical specifications to assist integration, power planning and thermal considerations in development and production designs.
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