5AGTMD3G3F31I3NAA

IC FPGA 384 I/O 896FBGA
Part Description

Arria V GT Field Programmable Gate Array (FPGA) IC 384 19822592 362000 896-BBGA, FCBGA

Quantity 737 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package896-FBGA (31x31)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case896-BBGA, FCBGANumber of I/O384Voltage1.12 V - 1.18 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs17110Number of Logic Elements/Cells362000
Number of GatesN/AECCNOBSOLETEHTS Code0000.00.0000
QualificationN/ATotal RAM Bits19822592

Overview of 5AGTMD3G3F31I3NAA – Arria V GT FPGA, 362,000 logic elements, 19,822,592 RAM bits, 384 I/Os, 896‑BBGA

The 5AGTMD3G3F31I3NAA is an Arria V GT Field Programmable Gate Array (FPGA) in an 896‑BBGA (896‑FBGA, 31×31) package designed for industrial‑grade systems. It provides a high density of programmable logic and on‑chip RAM combined with a large I/O count to address complex, customizable digital designs.

This device is targeted at applications that require substantial logic resources and embedded memory while operating across an industrial temperature range. Key value comes from its large logic element count, significant on‑chip RAM, and a 384‑pin I/O footprint in a surface‑mount FCBGA package.

Key Features

  • Logic Capacity — 362,000 logic elements to implement complex digital functions and large custom logic blocks.
  • On‑Chip Memory — 19,822,592 total RAM bits for embedded buffering, state storage, and memory‑intensive algorithms.
  • I/O Resources — 384 programmable I/O pins to support broad peripheral connectivity and multi‑channel interfacing.
  • Power Supply — Core operating voltage specified between 1.12 V and 1.18 V for defined power planning and regulator selection.
  • Industrial Grade — Rated as Industrial with an operating temperature range of −40 °C to 100 °C for demanding environments.
  • Package & Mounting — 896‑BBGA (supplier device package: 896‑FBGA, 31×31) surface‑mount package for compact board integration.
  • Standards Compliance — RoHS compliant to meet environmental and manufacturing requirements.

Typical Applications

  • Custom high‑density FPGA designs — Use the 362,000 logic elements and extensive on‑chip RAM to implement large, tailored digital systems and complex control logic.
  • Multi‑I/O interfacing and aggregation — 384 I/Os enable aggregation of multiple peripheral channels, sensors, and interfaces on a single device.
  • Industrial embedded systems — Industrial temperature rating (−40 °C to 100 °C) supports deployment in factory automation and industrial control applications.

Unique Advantages

  • High logic density: 362,000 logic elements reduce the need for multiple devices when implementing large functions, simplifying board design.
  • Significant on‑chip RAM: 19,822,592 total RAM bits provide local memory for buffering and state retention, improving system determinism.
  • Large I/O count: 384 I/Os allow versatile external connectivity without external multiplexing or additional interface chips.
  • Industrial operating range: −40 °C to 100 °C supports reliable operation in harsh or temperature‑variable environments.
  • Compact BGA package: 896‑FBGA (31×31) surface‑mount format enables high integration density and compatibility with modern PCB assembly.
  • Regulatory readiness: RoHS compliance aligns with common manufacturing and environmental requirements.

Why Choose 5AGTMD3G3F31I3NAA?

The 5AGTMD3G3F31I3NAA Arria V GT FPGA balances large programmable logic capacity with substantial embedded RAM and a high I/O count, making it well suited for industrial designs that require on‑device integration of complex functions. Its defined core voltage range and industrial temperature rating help simplify system power and thermal planning for long‑term deployments.

This device is ideal for engineering teams building custom, high‑density digital systems that benefit from a single, RoHS‑compliant FPGA solution in a compact 896‑BBGA package. It provides a scalable platform for designs that need significant logic, memory, and I/O without fragmenting functionality across multiple components.

Request a quote or submit an inquiry for pricing and availability of 5AGTMD3G3F31I3NAA to move your project forward.

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