5AGTMD3G3F31I5G
| Part Description |
Arria V GT Field Programmable Gate Array (FPGA) IC 384 19822592 362000 896-BBGA, FCBGA |
|---|---|
| Quantity | 142 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 896-FBGA (31x31) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 896-BBGA, FCBGA | Number of I/O | 384 | Voltage | 1.07 V - 1.13 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 17110 | Number of Logic Elements/Cells | 362000 | ||
| Number of Gates | N/A | ECCN | PENDING ECCN | HTS Code | 0000.00.0000 | ||
| Qualification | N/A | Total RAM Bits | 19822592 |
Overview of 5AGTMD3G3F31I5G – Arria V GT Field Programmable Gate Array (FPGA) IC
The 5AGTMD3G3F31I5G is an Intel Arria V GT family FPGA in an industrial-grade device grade, delivering a high-density programmable fabric and transceiver-capable architecture. It combines extensive logic resources, embedded RAM, and a large I/O count in a compact 896-FBGA (31×31) FCBGA package for integration into demanding embedded and industrial systems.
This device is well suited to designs that require up to 362,000 logic elements, nearly 19.8 Mbits of on-chip RAM, and 384 I/O connections while operating across a wide industrial temperature range and narrow core-voltage window for consistent system behavior.
Key Features
- Core Logic Up to 362,000 logic elements (logic cells) to implement high-density digital functions and complex RTL designs.
- Embedded Memory 19,822,592 total RAM bits of on-chip memory for buffering, lookup tables, and intermediate data storage.
- I/O Density 384 I/O pins to support wide parallel interfaces, multiple peripherals, or multi-lane connectivity requirements.
- Industrial Grade & Temperature Range Rated for industrial operation with an operating temperature range of −40 °C to 100 °C for deployment in extended-temperature environments.
- Power Supply Core voltage operating range specified at 1.07 V to 1.13 V to match regulated power rails and enable predictable power design.
- Package & Mounting Surface-mount 896-BBGA FCBGA package (896-FBGA, 31×31) providing a compact footprint for board-level integration.
Typical Applications
- Communications & Networking — Implement protocol processing and transceiver-aware logic where high I/O counts and dense logic are required.
- Industrial Automation — On-chip memory and robust temperature rating support deterministic control, data aggregation, and real-time processing in industrial systems.
- High-density Embedded Systems — Use the large logic and RAM resources for complex embedded processing, custom accelerators, and multi-function SoC-style designs.
- Signal Processing — Leverage the device’s logic and memory capacity for buffering, pipelining, and parallel data-path implementations.
Unique Advantages
- High logic capacity: 362,000 logic elements enable integration of large, complex designs without external programmable logic.
- Substantial on-chip RAM: Nearly 19.8 Mbits of embedded RAM reduces the need for external memory for many buffering and LUT applications.
- Extensive I/O connectivity: 384 I/O pins allow flexible interfacing to wide buses, multiple peripherals, or multi-lane physical interfaces.
- Industrial temperature rating: Operation from −40 °C to 100 °C supports deployment in harsh or temperature-critical environments.
- Compact BGA package: 896-FBGA (31×31) provides a high-density, surface-mount form factor suitable for space-constrained PCBs.
- Controlled core voltage: Narrow supply window (1.07 V–1.13 V) simplifies power-supply design for predictable device behavior.
Why Choose 5AGTMD3G3F31I5G?
The 5AGTMD3G3F31I5G Arria V GT FPGA provides a balance of high logic density, substantial embedded memory, and broad I/O in a single industrial-grade package. Its specifications make it suitable for engineering teams building complex, I/O-rich systems that must operate reliably across extended temperature ranges.
Choose this device when your design requires scalable programmable logic, abundant on-chip RAM, and the I/O capacity to connect multiple subsystems while maintaining a compact board footprint and consistent power-supply requirements.
If you would like pricing, availability, or a formal quote for 5AGTMD3G3F31I5G, please request a quote or submit an inquiry through your preferred procurement channel.

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