5AGXA3F31I3NAC

The 5AGXA3F31I3NAC is an Arria V GX field programmable gate array (FPGA) in an industrial-grade speed and temperature offering. It delivers a high on-chip logic capacity and memory footprint combined with a large I/O count in a compact 896‑ball FCBGA (31×31) package.

Designed for applications that require significant programmable logic, abundant embedded RAM, and extensive external interfacing, this device provides a balance of integration and thermal range to support demanding embedded and industrial deployments.

Key Features

• Logic Capacity — 148,670 logic elements to implement complex custom digital functions and parallel processing pipelines.
• Embedded Memory — 893,952 total on-chip RAM bits for buffering, frame storage, and intermediate data structures.
• I/O Density — 416 user I/O pins to support multiple external interfaces and parallel data paths.
• Industrial Grade & Temperature Range — Rated for industrial operation with an operating temperature range of −40 °C to 100 °C.
• Core Voltage — Low-voltage core operation with a supply range of 1.12 V to 1.18 V.
• Package & Mounting — 896‑BBGA FCBGA package (supplier device package: 896‑FBGA, 31×31) optimized for surface-mount assembly.
• Regulatory — RoHS compliant.

Typical Applications

• Custom digital acceleration — Leverage 148,670 logic elements and abundant on-chip RAM for implementing application-specific processing blocks.
• I/O‑intensive designs — Use 416 I/O pins to connect to high-channel-count sensors, parallel buses, or multiple peripherals.
• Industrial embedded systems — Industrial-grade temperature rating and robust packaging suit deployments requiring extended environmental tolerance.

Unique Advantages

• High logic density: 148,670 logic elements enable large-scale programmable designs without external logic expansion.
• Significant on-chip memory: 893,952 RAM bits reduce dependence on external memory for many buffering and storage tasks.
• Extensive external connectivity: 416 I/O pins provide flexibility for parallel interfaces and mixed-signal front ends.
• Industrial reliability: Specified operation from −40 °C to 100 °C supports extended-temperature deployments.
• Space-efficient package: 896‑FBGA (31×31) ball array delivers high integration in a compact surface-mount form factor.
• Standards‑conscious supply: RoHS compliance helps meet environmental sourcing requirements.

Why Choose 5AGXA3F31I3NAC?

The 5AGXA3F31I3NAC positions itself as a robust, high-capacity Arria V GX FPGA option for engineers who need a combination of large logic resources, substantial on-chip RAM, and a high I/O count in an industrial-temperature, surface-mount package. Its low-voltage core operation and compact 896‑FBGA footprint make it suitable for designs where integration density and environmental tolerance are important.

For teams developing custom digital accelerators, I/O-heavy embedded platforms, or industrial control systems, this device offers a measured balance of logic, memory, and connectivity backed by the Arria V device family specifications.

If you would like pricing, availability, or to request a formal quote for 5AGXA3F31I3NAC, submit an inquiry or request a quote and our team will respond with the details you need.