5AGTMD3G3F31I3N

The 5AGTMD3G3F31I3N is an Arria V GT Field Programmable Gate Array (FPGA) IC from Intel, offered in an industrial grade package. It delivers high logic capacity, substantial on‑chip RAM, and a large I/O complement in a 896‑ball FCBGA package for surface‑mount assembly.

This device targets designs that require dense programmable logic and extensive embedded memory while operating across an industrial temperature range and a low‑voltage core supply.

Key Features

• Logic Capacity — 242,000 logic elements to implement complex digital designs and custom logic blocks.
• On‑chip Memory — 19,822,592 total RAM bits for buffering, packet processing, and intermediate storage within the FPGA fabric.
• I/O Density — 384 I/O pins to support wide interfaces, parallel buses, and mixed‑signal connectivity requirements.
• Supply Voltage — Core voltage specified at 1.12 V to 1.18 V to match low‑voltage power domains.
• Industrial Grade & Temperature Range — Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
• Package & Mounting — 896‑BBGA (FCBGA) package; supplier device package listed as 896‑FBGA (31×31); surface mount mounting type for PCB assembly.
• Regulatory — RoHS compliant.

Typical Applications

• High‑density digital systems — Use the large logic element count and RAM to implement complex state machines, data path processing, or custom accelerators.
• Interface aggregation — Leverage 384 I/Os to consolidate multiple parallel and serial interfaces on a single FPGA fabric.
• Industrial control and automation — Industrial temperature rating and robust packaging make it suitable for factory automation and control equipment designs.
• Embedded system prototyping — High logic and memory resources enable evaluation and prototyping of system architectures before production.

Unique Advantages

• High integration density: 242,000 logic elements plus nearly 20 million RAM bits reduce external component count and simplify board-level design.
• Wide I/O capability: 384 I/Os allow flexible connectivity and the ability to interface directly with multiple peripheral and bus standards without extensive external glue logic.
• Industrial temperature support: −40 °C to 100 °C rating provides headroom for deployment in harsh or temperature‑variable environments.
• Compact surface‑mount package: 896‑BBGA FCBGA (31×31) enables high‑density PCB layouts while maintaining solderability for automated assembly.
• Low‑voltage core: Narrow core voltage range (1.12 V–1.18 V) simplifies power‑rail design for the FPGA core domain.
• RoHS compliant: Conforms to common lead‑free manufacturing and environmental requirements.

Why Choose 5AGTMD3G3F31I3N?

The 5AGTMD3G3F31I3N provides a balanced combination of high logic density, significant embedded RAM, and a large I/O count in an industrial‑rated Arria V GT FPGA package from Intel. Its specifications suit engineers and designers who need a programmable solution capable of consolidating complex digital functions and interface logic within a single, surface‑mount device.

Choose this part when you require a robust, high‑capacity FPGA for industrial applications or space‑constrained boards that demand substantial on‑chip resources and a high pin count.

Request a quote or contact sales to discuss availability, lead times, and to obtain additional ordering information for the 5AGTMD3G3F31I3N.