5AGTMC7G3F31I5N
| Part Description |
Arria V GT Field Programmable Gate Array (FPGA) IC 384 15470592 242000 896-BBGA, FCBGA |
|---|---|
| Quantity | 41 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 896-FBGA (31x31) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 896-BBGA, FCBGA | Number of I/O | 384 | Voltage | 1.07 V - 1.13 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 11460 | Number of Logic Elements/Cells | 242000 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 15470592 |
Overview of 5AGTMC7G3F31I5N – Arria V GT Field Programmable Gate Array (FPGA), 242000 logic elements
The 5AGTMC7G3F31I5N is an Arria V GT Field Programmable Gate Array (FPGA) IC in an 896-ball FCBGA package designed for industrial-grade applications. It provides a high-density programmable logic fabric with substantial on-chip RAM and a large I/O complement for complex embedded and industrial systems.
Key technical advantages include 242,000 logic elements, 15,470,592 total RAM bits, 384 I/O pins, a compact 896-FBGA (31×31) surface-mount package, and a specified operating temperature range of −40 °C to 100 °C.
Key Features
- Core Logic 242,000 logic elements for implementing large-scale programmable logic functions and custom processing pipelines.
- On-Chip Memory 15,470,592 total RAM bits to support buffering, lookup tables, and embedded data storage.
- I/O Density 384 I/O pins to accommodate broad interfacing requirements with external devices and subsystems.
- Package & Mounting 896-BBGA (FCBGA) / 896-FBGA (31×31) surface-mount package for dense board-level integration.
- Power Core voltage supply specified between 1.07 V and 1.13 V for defined power domain planning.
- Industrial Temperature Range Rated for −40 °C to 100 °C operation, suitable for industrial environments.
- Regulatory RoHS compliant.
Typical Applications
- Industrial control systems High logic density and extended temperature range enable complex control logic and deterministic processing in industrial environments.
- Embedded processing Large on-chip RAM and abundant logic elements support custom datapaths and hardware-accelerated functions for embedded platforms.
- Communications and I/O aggregation 384 I/O pins provide capacity for protocol bridging, I/O expansion, and peripheral aggregation.
Unique Advantages
- High integration density: 242,000 logic elements and over 15 million RAM bits allow consolidation of multiple functions into a single FPGA, reducing external component count.
- Generous I/O resources: 384 I/O pins enable flexible interfacing options and support for multi-peripheral systems without immediate need for external I/O expanders.
- Industrial readiness: Specified operation from −40 °C to 100 °C and an Industrial grade designation provide a predictable platform for industrial deployments.
- Compact, manufacturable package: 896-FBGA (31×31) surface-mount format delivers a balance of board density and routability for production assemblies.
- Controlled core supply range: Defined 1.07–1.13 V core voltage range aids in power-supply design and system-level power budgeting.
- RoHS compliant: Meets lead-free and hazardous-substance directives for modern manufacturing standards.
Why Choose 5AGTMC7G3F31I5N?
The 5AGTMC7G3F31I5N Arria V GT FPGA combines substantial logic capacity, large on-chip memory, and a high I/O count in a production-friendly 896-ball FCBGA package. Its industrial temperature rating and RoHS compliance make it a fit for long-lived embedded and industrial designs that require a programmable, reconfigurable silicon platform.
This device is suited to engineering teams that need to integrate complex control, data-path, or I/O aggregation functions into a single semiconductor footprint while maintaining defined power and thermal envelopes.
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