5AGTMC3D3F27I5N
| Part Description |
Arria V GT Field Programmable Gate Array (FPGA) IC 336 11746304 156000 672-BBGA, FCBGA |
|---|---|
| Quantity | 992 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 672-FBGA (27x27) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 672-BBGA, FCBGA | Number of I/O | 336 | Voltage | 1.07 V - 1.13 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 7362 | Number of Logic Elements/Cells | 156000 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 11746304 |
Overview of 5AGTMC3D3F27I5N – Arria V GT FPGA, 156,000 Logic Elements, 672-FBGA
The 5AGTMC3D3F27I5N is an Intel Arria V GT field-programmable gate array (FPGA) in a 672-ball FCBGA package, specified for industrial operation. It provides a high-density programmable fabric combined with large on-chip RAM and extensive I/O capacity for demanding embedded and system designs.
Engineered for applications that require significant logic capacity, on-chip memory, and a broad I/O count, this device offers a tightly constrained core voltage range and an extended operating temperature window for robust deployment in industrial environments.
Key Features
- Logic Capacity Provides 156,000 logic elements and 7,362 logic array blocks for implementing complex programmable logic and custom functions.
- On-chip Memory Includes 11,746,304 total RAM bits to support large buffering, caching, and state storage within the FPGA fabric.
- I/O Resources Offers 336 I/O pins to support multiple interfaces and parallel connections to external devices and peripherals.
- Package and Mounting Supplied in a 672-ball FCBGA package (672-FBGA, 27×27) for surface-mount PCB assembly, enabling compact board-level integration.
- Power and Core Voltage Core supply operates within a narrow range of 1.07 V to 1.13 V, enabling predictable power delivery and thermal planning.
- Temperature and Grade Rated for industrial use with an operating temperature range of −40°C to 100°C for reliable operation across extended environments.
- Regulatory RoHS compliant, supporting lead-free assembly and environmental requirements.
Typical Applications
- Industrial Control Systems High logic and on-chip RAM enable complex state machines, signal processing, and control loops within rugged industrial equipment operating across −40°C to 100°C.
- High-density Embedded Processing Large logic element and RAM counts support custom accelerators, protocol bridges, and embedded compute tasks that require substantial on-chip resources.
- Interface Aggregation and I/O Expansion With 336 I/Os, the device is suited to aggregate multiple peripheral interfaces, manage parallel sensors, or implement wide data buses.
Unique Advantages
- High Logic and Memory Integration: 156,000 logic elements combined with 11,746,304 RAM bits reduce the need for external logic and memory, simplifying BOM and board area.
- Extensive I/O: 336 I/O pins provide flexibility to connect diverse peripherals and implement multiple simultaneous interfaces without external multiplexing.
- Industrial Temperature Rating: Operation from −40°C to 100°C supports deployment in harsh or temperature-variable environments.
- Compact, Surface-Mount Package: 672-FBGA (27×27) package delivers high-density integration suitable for space-constrained PCBs.
- Tightly Controlled Core Voltage: The 1.07 V to 1.13 V supply window enables consistent power planning and thermal management for system designers.
- RoHS Compliant: Supports lead-free manufacturing and regulatory requirements for modern electronics production.
Why Choose 5AGTMC3D3F27I5N?
The 5AGTMC3D3F27I5N Arria V GT FPGA combines a high count of logic elements and substantial on-chip RAM with extensive I/O capacity in a compact 672-FBGA package, all specified for industrial temperature operation. This combination makes it well suited to embedded and industrial designs that require dense programmable logic, significant internal memory, and numerous external connections while maintaining a predictable power profile.
Designers seeking scalable, robust programmable logic for complex control, interface aggregation, or embedded acceleration will find this device aligns with long-term deployment needs, offering integration and environmental tolerance that support reliable systems engineering and reduced external component requirements.
If you would like pricing, availability, or a formal quote for the 5AGTMC3D3F27I5N, please submit a request for a quote or an inquiry to receive detailed purchasing information and lead-time estimates.

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