5AGXBB1D6F31C6G

IC FPGA 384 I/O 896FBGA
Part Description

Arria V GX Field Programmable Gate Array (FPGA) IC 384 17358848 300000 896-BBGA, FCBGA

Quantity 991 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package896-FBGA (31x31)GradeCommercialOperating Temperature0°C – 85°C
Package / Case896-BBGA, FCBGANumber of I/O384Voltage1.07 V - 1.13 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs14151Number of Logic Elements/Cells300000
Number of GatesN/AECCNPENDING ECCNHTS Code0000.00.0000
QualificationN/ATotal RAM Bits17358848

Overview of 5AGXBB1D6F31C6G – Arria V GX FPGA, 300,000 logic elements, ~17.36 Mbits RAM, 384 I/Os, 896-BBGA

The 5AGXBB1D6F31C6G is an Intel Arria V GX field-programmable gate array (FPGA) in a 896-BBGA FCBGA package. It delivers a large programmable logic capacity and substantial on-chip memory, combined with a high I/O count and a compact surface-mount BGA footprint.

Targeted at designs that require dense logic, embedded memory, and high I/O integration, this commercial-grade device operates with a core supply between 1.07 V and 1.13 V and an operating temperature range of 0 °C to 85 °C. The device is RoHS compliant.

Key Features

  • Logic Capacity  Approximately 300,000 logic elements, supported by 14,151 CLB-equivalent units, for complex programmable logic implementations.
  • Embedded Memory  Approximately 17.36 Mbits of on-chip RAM, enabling local buffering, lookup tables, and on-chip data storage for high-throughput designs.
  • I/O Density  384 user I/O pins to support wide parallel interfaces and multiple high-pin-count peripherals.
  • Package & Mounting  896-BBGA (FCBGA) package, supplier device package: 896-FBGA (31×31), optimized for surface-mount PCB assembly and compact board layouts.
  • Power  Core voltage supply range of 1.07 V to 1.13 V for predictable power budgeting and core supply design.
  • Operating Range & Grade  Commercial grade device rated for 0 °C to 85 °C operation.
  • Regulatory Compliance  RoHS compliant, supporting regulatory and environmental requirements for many commercial applications.

Typical Applications

  • High-density digital signal processing  Leverage the large logic capacity and embedded memory for algorithms that require parallel computation and on-chip buffering.
  • Network and packet processing  High I/O count and dense logic enable implementation of packet engines, protocol parsing, and custom forwarding logic.
  • Video and image processing  Sufficient on-chip RAM and logic resources to implement preprocessing, frame buffering, and custom video pipelines.
  • Prototyping and complex system integration  Compact BGA packaging and high resource counts make this FPGA suitable for system-level prototyping and integration where board space is constrained.

Unique Advantages

  • High programmable density: Large logic element count supports complex algorithms and multi-function designs without immediate need for multiple devices.
  • Substantial embedded memory: Approximately 17.36 Mbits of on-chip RAM reduces reliance on external memory for many buffering and LUT needs.
  • Robust I/O capability: 384 I/Os provide flexibility for parallel interfaces, multi-channel data paths, and extensive peripheral connectivity.
  • Compact package: 896-BBGA (31×31) FCBGA packaging balances high-pin-count requirements with a small board footprint for space-constrained designs.
  • Predictable power envelope: Narrow core voltage supply window (1.07 V–1.13 V) simplifies core power supply design and budgeting.
  • Commercial-grade availability: Rated for 0 °C to 85 °C operation and RoHS compliant for broad commercial deployments.

Why Choose 5AGXBB1D6F31C6G?

The 5AGXBB1D6F31C6G Arria V GX FPGA combines a high logic element count with significant embedded memory and a large I/O complement in a compact 896-BBGA package, making it well suited for commercial designs that need high integration density and flexible I/O. Its defined core voltage range and commercial temperature rating provide predictable integration requirements for system designers.

This device is appropriate for teams building complex, scalable FPGA-based systems that demand on-chip resources and a compact board footprint, and for projects where RoHS compliance and commercial operating coverage are required.

Request a quote or submit an inquiry to receive pricing and availability information for 5AGXBB1D6F31C6G. Provide your project requirements and desired quantities to expedite a response.

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