5AGXBB1D6F31C6N

The 5AGXBB1D6F31C6N is an Intel Arria V GX field-programmable gate array (FPGA) supplied in a commercial-grade, surface-mount 896-BBGA (FCBGA) package. This device integrates 300,000 logic elements, approximately 17.36 Mbits of embedded memory, and 384 I/Os to support complex, high-density programmable logic implementations.

Designed for applications that require high gate density and significant on-chip RAM in a compact 31 × 31 mm FBGA footprint, the device operates from a core voltage range of 1.07 V to 1.13 V and within a commercial temperature range of 0 °C to 85 °C. The unit is RoHS compliant.

Key Features

• Core Capacity  300,000 logic elements to implement large-scale programmable logic, custom datapaths, and complex control functions.
• Embedded Memory  Approximately 17.36 Mbits of on-chip RAM for buffering, LUT-based storage, and local data structures.
• I/O Density  384 I/Os to support wide parallel interfaces, multiple peripherals, and board-level connectivity.
• Package & Mounting  896-BBGA (FCBGA) supplier device package 896-FBGA (31 × 31) in a surface-mount form factor for compact board layouts.
• Power  Core supply voltage specified from 1.07 V to 1.13 V to meet device operating requirements.
• Operating Range  Commercial temperature grade with an operating temperature range of 0 °C to 85 °C.
• Environmental Compliance  RoHS compliant to support regulatory requirements for lead-free assembly.

Typical Applications

• High-density logic integration  Deploys the device’s 300,000 logic elements and embedded RAM to consolidate complex logic functions and reduce external component count.
• I/O-intensive systems  Uses the 384 I/Os for wide parallel interfaces, multi-channel data acquisition, or board-level peripheral aggregation.
• Embedded memory-centric designs  Leverages approximately 17.36 Mbits of on-chip RAM for buffering, packet processing, and local data storage needs.

Unique Advantages

• High logic density: 300,000 logic elements enable implementation of large programmable designs without immediate need for external logic expansion.
• Substantial on-chip RAM: Approximately 17.36 Mbits of embedded memory reduces dependence on external memory for intermediate storage and buffering.
• Extensive I/O count: 384 I/Os provide flexibility for parallel interfaces and multi-channel connectivity in compact system designs.
• Compact FBGA package: 896-FBGA (31 × 31) in a surface-mount form factor simplifies PCB integration while maintaining high pin count.
• Commercial-grade operating range: Specified 0 °C to 85 °C operation and tightly defined core voltage range (1.07 V–1.13 V) for predictable system behavior.
• Regulatory readiness: RoHS compliance supports lead-free manufacturing flows.

Why Choose 5AGXBB1D6F31C6N?

This Arria V GX FPGA delivers a balanced combination of logic capacity, embedded memory, and I/O resources in a compact 896-BBGA package, making it well suited for designs that require significant on-chip integration within a commercial temperature range. The defined core-voltage window and RoHS compliance support predictable electrical integration and modern assembly processes.

Choose 5AGXBB1D6F31C6N for projects that demand high gate density, substantial on-chip RAM, and a large I/O complement while maintaining a compact board footprint and standard commercial operating conditions.

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