5AGXBB3D4F35I5N

The 5AGXBB3D4F35I5N is an Intel Arria V GX field-programmable gate array designed for high-density logic and memory integration. It combines approximately 362,000 logic elements with about 19.8 Mbits of embedded RAM and 544 user I/O to address designs that require large programmable fabric and substantial on-chip storage.

Packaged in a 1152-BBGA (35×35) exposed-pad surface-mount package and specified for industrial-grade operation, this device targets systems that need robust I/O, significant logic capacity, and operation across a wide temperature range. The device’s core supply operates between 1.07 V and 1.13 V.

Key Features

• Core Logic Capacity  Approximately 362,000 logic elements provide substantial programmable fabric for complex digital functions and custom acceleration.
• Embedded Memory  Approximately 19.8 Mbits of on-chip RAM for buffering, lookup tables, and local storage to support high-throughput algorithms.
• High I/O Count  544 user I/Os enable dense connectivity for multi-channel interfaces, parallel buses, and wide data paths.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C to meet temperature demands of industrial applications.
• Core Power  Core supply range of 1.07 V to 1.13 V for predictable power budgeting and design integration.
• Package & Mounting  1152-BBGA, FCBGA exposed-pad package (supplier package: 1152-FBGA, 35×35) in a surface-mount form factor for board-level assembly.
• RoHS Compliant  Manufactured to meet RoHS environmental compliance status.

Typical Applications

• Industrial Control & Automation  Industrial-grade temperature rating and extensive I/O make this device suitable for distributed control, motor drives, and factory automation interfaces.
• High-density Data Processing  Large logic capacity and embedded memory support compute-intensive signal processing, data buffering, and custom pipeline implementations.
• Telecommunications & Networking  High I/O count and on-chip RAM enable wide parallel data paths and protocol bridging in network infrastructure equipment.
• Complex System Integration  The 1152-BBGA exposed-pad package and surface-mount mounting suit compact, integrated boards that require substantial programmable logic and connectivity.

Unique Advantages

• High Logic Density: Enables consolidation of multiple functions into a single device, reducing external components and board complexity.
• Significant Embedded Memory: Approximately 19.8 Mbits of on-chip RAM reduce reliance on external memory for many buffering and state-storage tasks.
• Extensive I/O Resources: 544 user I/Os provide flexibility for parallel interfaces, multi-channel inputs, and broad system connectivity.
• Industrial Reliability: Specified for −40 °C to 100 °C operation to support demanding environmental conditions.
• Compact, Robust Packaging: 1152-BBGA (35×35) exposed-pad package supports thermal performance and high-pin-count board designs.
• Predictable Power Envelope: Narrow core supply range (1.07 V–1.13 V) simplifies power-supply design and margin planning.

Why Choose 5AGXBB3D4F35I5N?

The 5AGXBB3D4F35I5N delivers a balance of high logic capacity, substantial embedded memory, and broad I/O in an industrial-grade Arria V GX FPGA. Its combination of approximately 362,000 logic elements, roughly 19.8 Mbits of on-chip RAM, and 544 I/Os is well suited to designs that require integrated digital processing, buffering, and extensive external connectivity within a compact surface-mount package.

Designed for engineers building resilient, high-density systems, this Intel FPGA offers predictable operating parameters and a package format that supports thermally-aware board designs and dense interconnect. It is appropriate for teams seeking a scalable, programmable platform with strong on-chip resources and industrial temperature capability.

Request a quote or submit an inquiry to evaluate 5AGXBB3D4F35I5N for your next design and receive pricing and availability details.