5AGXBB3D4F35C5N
| Part Description |
Arria V GX Field Programmable Gate Array (FPGA) IC 544 19822592 362000 1152-BBGA, FCBGA Exposed Pad |
|---|---|
| Quantity | 4 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA (35x35) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA Exposed Pad | Number of I/O | 544 | Voltage | 1.07 V - 1.13 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 17110 | Number of Logic Elements/Cells | 362000 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 19822592 |
Overview of 5AGXBB3D4F35C5N – Arria V GX FPGA, 362,000 logic elements, 544 I/O, 1152-BBGA (Exposed Pad)
The 5AGXBB3D4F35C5N is an Intel Arria V GX field-programmable gate array (FPGA) offered in a commercial-grade device package. It combines high logic capacity with substantial on-chip memory and a large I/O count, packaged for surface-mount board integration. Typical deployments include complex programmable logic implementations in commercial electronic systems that require dense logic, significant embedded memory, and high pin count connectivity.
Key Features
- Core capacity — 362,000 logic elements providing substantial programmable fabric for complex designs.
- Embedded memory — approximately 19.8 Mbits of on-chip RAM to support buffering, look‑up tables, and local storage.
- I/O density — 544 general-purpose I/O pins for extensive peripheral and system integration.
- Power domain — core supply operating range 1.07 V to 1.13 V, allowing precise core-power budgeting and sequencing.
- Package & mounting — 1152-BBGA, FCBGA exposed pad (supplier device package: 1152-FBGA, 35 × 35 mm) designed for surface-mount assembly.
- Operating grade & temperature — commercial grade, rated for 0 °C to 85 °C ambient operation.
- Standards compliance — RoHS compliant for lead-free environmental requirements.
Typical Applications
- Programmable logic integration — implement custom digital logic, glue logic, and system controllers where reconfigurability and high logic density are required.
- Data buffering and local storage — use the embedded RAM for packet buffering, FIFOs, and temporary data storage in complex data paths.
- High-pin-count system interfaces — leverage 544 I/O for multi-channel interfaces, bus bridging, and extensive peripheral connectivity in commercial systems.
Unique Advantages
- High-density programmable fabric: 362,000 logic elements enable implementation of large, integrated designs without external ASICs.
- Substantial embedded memory: approximately 19.8 Mbits of on-chip RAM reduces dependence on external memory for many buffering and storage tasks.
- Extensive I/O capability: 544 I/O pins support multi-channel interfacing and high connector counts for system expansion.
- System-ready package: 1152-BBGA exposed-pad package facilitates thermal management and surface-mount assembly in compact system boards.
- Commercial temperature grade: rated 0 °C to 85 °C for mainstream commercial electronics deployments.
- RoHS compliant: meets lead-free environmental requirements for modern product assemblies.
Why Choose 5AGXBB3D4F35C5N?
This Arria V GX FPGA balances high logic density, significant embedded memory, and a large I/O complement in a surface-mount BBGA package, making it a suitable choice for commercial designs that require reconfigurable, high-capacity programmable logic. Its defined core voltage range and commercial temperature rating enable predictable integration into mainstream electronic products.
Designers and procurement teams seeking a densely featured, RoHS-compliant FPGA for complex programmable tasks will find the 5AGXBB3D4F35C5N aligned with needs for integration density, local memory, and I/O scalability.
Request a quote or submit an inquiry to discuss availability, lead times, and pricing for 5AGXBB3D4F35C5N.

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