5AGXBB3D4F31I5N

The 5AGXBB3D4F31I5N is an Intel Arria V GX field programmable gate array (FPGA) supplied in an 896-BBGA (896-FBGA, 31×31) surface-mount package. It provides a large programmable logic fabric coupled with significant on-chip memory and a high I/O count for complex, high-density embedded designs.

Designed for industrial-grade applications, this device operates over a wide temperature range and supports a narrow core supply range, enabling predictable power and thermal planning for long-life deployments.

Key Features

• High logic capacity – 362,000 logic elements to implement large-scale digital designs and complex state machines.
• Embedded memory – approximately 19.82 Mbits of on-chip RAM for buffers, FIFOs, and embedded data storage.
• Rich I/O – 384 user I/O pins to support wide parallel interfaces and multiple peripheral connections.
• Industrial grade – specified as Industrial grade with an operating temperature range from –40 °C to 100 °C for robust performance in demanding environments.
• Power supply precision – core voltage supply specified between 1.07 V and 1.13 V for consistent core operation and power budgeting.
• Package and mounting – supplied in an 896-FBGA (31×31) / 896-BBGA, FCBGA package for surface-mount assembly.
• Regulatory compliance – RoHS compliant.
• Detailed device documentation – Arria V device datasheet contains extensive electrical, switching, configuration, and I/O timing specifications for system design and validation.

Typical Applications

• High-density signal processing – Large logic capacity and on-chip RAM support implementation of complex DSP pipelines and real-time processing engines.
• Custom data-path acceleration – Ample logic and memory resources enable designers to offload compute-intensive functions into a programmable fabric.
• Multi-interface bridging – 384 I/Os provide the pin count needed to interface with multiple parallel buses, sensors, and external devices in embedded systems.
• Industrial control systems – Industrial-grade temperature rating and robust packaging suit control and automation applications operating across wide environmental conditions.

Unique Advantages

• Substantial programmable fabric – 362,000 logic elements enable consolidation of multiple functions into a single device, reducing board-level complexity.
• Significant on-chip RAM – approximately 19.82 Mbits of embedded memory for low-latency buffering and state storage without external memory dependence.
• High I/O density – 384 I/Os simplify connectivity for complex systems and help minimize external hub devices.
• Industrial temperature capability – specified operation from –40 °C to 100 °C supports deployment in harsh or wide-range temperature environments.
• Compact, surface-mount package – 896-FBGA (31×31) package enables high-density PCB implementations while maintaining manufacturability.
• Standards-conscious sourcing – RoHS compliance supports environmental and regulatory requirements.

Why Choose 5AGXBB3D4F31I5N?

The 5AGXBB3D4F31I5N delivers a balanced combination of large logic capacity, substantial embedded memory, and extensive I/O in a durable industrial-grade package. Its tight core voltage specification and comprehensive datasheet information support precise power design and system integration.

This device is well suited to engineering teams building high-density FPGA-based solutions that require on-chip memory, broad connectivity, and the environmental robustness typical of industrial deployments. Packaged by Intel, it offers a documented platform for detailed electrical, switching, and configuration planning.

Request a quote or submit an inquiry to obtain pricing, availability, and ordering information for 5AGXBB3D4F31I5N.