5AGXBB3D4F31I5G

The 5AGXBB3D4F31I5G is an Intel Arria V GX field programmable gate array (FPGA) supplied in an industrial-grade package. It integrates high-density programmable logic with substantial on-chip memory and a large I/O complement to support complex, multi‑interface digital designs.

With 362,000 logic elements, approximately 19.8 Mbits of embedded memory and 384 I/Os, this Arria V GX device targets designs that require sizable logic capacity, on‑chip storage, and broad I/O connectivity while operating from a core supply of 1.07 V to 1.13 V across an industrial temperature range.

Key Features

• High Logic Density — 362,000 logic elements provide extensive programmable logic resources for complex algorithms, control logic, and parallel processing functions.
• Embedded Memory — Approximately 19.8 Mbits of on‑chip RAM for buffering, packet storage, and state machines without immediate dependency on external memory.
• Large I/O Count — 384 general-purpose I/Os to support multiple interfaces, parallel data paths, and high pin-count application requirements.
• Industrial Grade Operation — Specified operating temperature range from –40 °C to 100 °C for deployment in industrial environments.
• Core Voltage Range — Core supply range of 1.07 V to 1.13 V to match system power-rail requirements and enable predictable core operation.
• Package and Mounting — Available in a 896-ball FBGA footprint (31×31) / 896-BBGA, FCBGA package and designed for surface-mount assembly.
• RoHS Compliant — Meets RoHS requirements for reduced hazardous substances.

Typical Applications

• High‑density digital processing — Use the 362,000 logic elements and substantial embedded RAM to implement complex signal processing pipelines and algorithm acceleration.
• Multi‑interface bridging and aggregation — 384 I/Os enable integration of multiple parallel or serial interfaces for protocol conversion and I/O aggregation tasks.
• Industrial control and automation — Industrial grade temperature rating and robust I/O count suit control systems, PLCs, and factory automation where extended temperature range is required.
• FPGA‑based prototyping and system integration — High logic capacity and on‑chip memory make the device suitable for prototype platforms and system‑level integration prior to ASIC development.

Unique Advantages

• Substantial on‑chip resources: 362,000 logic elements combined with ~19.8 Mbits of embedded memory reduce reliance on external logic and memory, simplifying board-level design.
• Broad I/O flexibility: 384 I/Os support multi‑channel interfacing and complex pinouts, enabling consolidated connectivity for dense systems.
• Industrial operation: Rated for –40 °C to 100 °C operation, offering thermal robustness for industrial deployments.
• Predictable core power: Narrow core voltage window (1.07 V–1.13 V) supports consistent core performance and power budgeting.
• Industry supplier: Delivered by Intel as part of the Arria V GX family, providing access to established device documentation and technical resources.
• Surface‑mount, high‑density package: 896‑ball FBGA / BBGA packaging enables compact PCB footprints for space‑constrained applications.

Why Choose 5AGXBB3D4F31I5G?

The 5AGXBB3D4F31I5G Arria V GX FPGA combines high logic density, significant embedded memory, and a large I/O count in an industrial-grade, surface-mount package. Its defined core voltage range and extended operating temperature make it a practical choice for engineers building complex digital systems that require on‑chip resources and robust connectivity.

This device is appropriate for design teams needing a scalable, well-documented FPGA platform from a major vendor, enabling accelerated development for high‑density processing, I/O‑heavy designs, and industrial applications where temperature tolerance and integration density are priorities.

Request a quote or submit an inquiry for pricing, availability, and lead-time information to evaluate the 5AGXBB3D4F31I5G for your next design.