5AGXBB3D4F31C4G

The 5AGXBB3D4F31C4G is an Intel Arria V GX Field Programmable Gate Array supplied in a 896-BBGA FCBGA package. It delivers high on-chip logic capacity, significant embedded memory, and a large I/O complement for board- and system-level designs.

Engineered for commercial applications, this device combines 362,000 logic elements, approximately 19.82 Mbits of embedded RAM, and 384 I/Os within a compact surface-mount 896-FBGA (31×31) footprint. It operates from a core supply range of 1.07 V to 1.13 V and across a commercial temperature window of 0 °C to 85 °C.

Key Features

• High Logic Capacity — 362,000 logic elements to implement large, complex programmable logic designs.
• Embedded Memory — Approximately 19.82 Mbits of on-chip RAM to support buffering, lookup tables, and on-chip data storage.
• Extensive I/O — 384 I/Os for broad external interfacing and high pin-count systems.
• Package and Mounting — 896-BBGA, FCBGA package (supplier device package: 896-FBGA, 31×31) in a surface-mount form factor for dense board integration.
• Power and Operating Range — Core voltage supply from 1.07 V to 1.13 V, specified for commercial-grade operation from 0 °C to 85 °C.
• Regulatory — RoHS compliant.

Typical Applications

• High-density logic implementations — Systems that require substantial programmable logic capacity can use the device's 362,000 logic elements to implement complex algorithms and custom hardware acceleration.
• On-chip buffering and data handling — Designs that need significant embedded memory can leverage approximately 19.82 Mbits of RAM for local storage and data processing tasks.
• High-pin-count interfacing — Applications requiring broad external connectivity can utilize the 384 I/Os for sensor arrays, parallel interfaces, or multi-channel I/O subsystems.
• Compact board-level integration — The 896-FBGA (31×31) surface-mount package supports dense PCB layouts where board real estate is constrained.

Unique Advantages

• Large programmable resource pool: 362,000 logic elements provide headroom for complex system functions without immediate migration.
• Substantial embedded memory: Approximately 19.82 Mbits of on-chip RAM reduces dependence on external memory for many buffering and table-driven tasks.
• High I/O capacity: 384 I/Os enable flexible interfacing to peripherals, parallel buses, and multi-channel front ends.
• Compact FCBGA package: 896-BBGA (896-FBGA, 31×31) delivers a high-pin-count solution in a surface-mount form factor suitable for space-constrained PCBs.
• Commercial-grade specification: Rated for 0 °C to 85 °C operation and RoHS compliant for standard commercial deployments.

Why Choose 5AGXBB3D4F31C4G?

The 5AGXBB3D4F31C4G Arria V GX FPGA balances large logic capacity, meaningful on-chip memory, and broad I/O density in a compact BGA package—making it a practical choice for commercial designs that require significant programmable resources and board-level integration. Its defined core voltage window and commercial temperature rating simplify power and thermal planning for system designers.

Backed by Intel’s Arria V family specification set, this part is suitable for design teams needing scalable programmable logic, embedded memory, and high I/O counts in a single component, while maintaining RoHS compliance for standard commercial product lifecycles.

Request a quote or submit an inquiry for pricing and availability of 5AGXBB3D4F31C4G to begin your design evaluation and procurement process.