5AGXBB3D4F40C5G

IC FPGA 704 I/O 1517FBGA
Part Description

Arria V GX Field Programmable Gate Array (FPGA) IC 704 19822592 362000 1517-BBGA, FCBGA

Quantity 1,368 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package1517-FBGA, FC (40x40)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1517-BBGA, FCBGANumber of I/O704Voltage1.07 V - 1.13 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs17110Number of Logic Elements/Cells362000
Number of GatesN/AECCNPENDING ECCNHTS Code0000.00.0000
QualificationN/ATotal RAM Bits19822592

Overview of 5AGXBB3D4F40C5G – Arria V GX Field Programmable Gate Array (FPGA) IC

The Intel Arria V GX device 5AGXBB3D4F40C5G is a high-density, commercial‑grade FPGA in a 1517‑BBGA FCBGA package. It provides extensive programmable logic and on‑chip memory combined with high I/O count for board‑level integration in commercial embedded systems operating between 0 °C and 85 °C. The device requires a core supply in the range of 1.07 V to 1.13 V.

Key Features

  • Core density  362,000 logic elements for complex programmable logic implementations.
  • Embedded memory  Approximately 19.8 Mbits of on‑chip RAM for buffering, state storage, and local data structures.
  • I/O capability  704 I/O pins to support extensive external interfacing and parallel connectivity.
  • Power and supply  Core voltage specification: 1.07 V to 1.13 V, enabling defined power design and supply sequencing.
  • Package and mounting  1517‑BBGA (FCBGA) package; supplier device package listed as 1517‑FBGA, FC (40×40); surface‑mount mounting type for PCB assembly.
  • Commercial grade temperature  Rated for 0 °C to 85 °C operation.
  • Environmental compliance  RoHS compliant.

Typical Applications

  • Commercial embedded systems  Suitable for board designs requiring a commercial‑grade FPGA with defined operating temperature and supply conditions.
  • High‑density programmable logic  Used where large amounts of logic resources are needed on a single device.
  • I/O‑intensive designs  Ideal for systems that require many external interfaces or wide parallel connectivity via 704 I/O pins.
  • Memory‑heavy functions  On‑chip RAM (≈19.8 Mbits) supports local buffering and data handling within the FPGA fabric.

Unique Advantages

  • High logic integration: 362,000 logic elements reduce the need for external discrete logic and simplify system architecture.
  • Substantial on‑chip memory: Approximately 19.8 Mbits of embedded RAM enables larger local datasets and buffer storage without external memory.
  • Extensive external connectivity: 704 I/O pins provide flexibility for multi‑lane interfaces, parallel buses, and mixed‑signal front ends.
  • Surface‑mount FCBGA package: 1517‑BBGA (1517‑FBGA, 40×40) supports compact, manufacturable board layouts for commercial assemblies.
  • Clear supply and thermal envelope: Defined core voltage range (1.07–1.13 V) and commercial temperature rating simplify power and thermal planning.
  • RoHS compliant: Meets common environmental requirements for commercial electronics.

Why Choose 5AGXBB3D4F40C5G?

The 5AGXBB3D4F40C5G Arria V GX FPGA combines a large logic fabric, significant embedded memory, and a high I/O count in a surface‑mount 1517‑BBGA package tailored for commercial designs. Its defined core voltage range and 0 °C to 85 °C operating window make it straightforward to integrate into commercial‑grade systems that demand on‑device programmability and dense resources.

This part is suited to engineers and procurement teams building compact, high‑integration boards where consolidating logic, memory, and I/O into a single FPGA reduces BOM complexity and streamlines PCB design and assembly.

Request a quote or submit an inquiry to get pricing, availability, and technical support details for 5AGXBB3D4F40C5G.

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