5AGXBB3D4F40I5N
| Part Description |
Arria V GX Field Programmable Gate Array (FPGA) IC 704 19822592 362000 1517-BBGA |
|---|---|
| Quantity | 241 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-FBGA (40x40) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA | Number of I/O | 704 | Voltage | 1.07 V - 1.13 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 17110 | Number of Logic Elements/Cells | 362000 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 19822592 |
Overview of 5AGXBB3D4F40I5N – Arria V GX Field Programmable Gate Array (FPGA), 704 I/O, ~19.8 Mbits RAM
The 5AGXBB3D4F40I5N is an Intel Arria V GX FPGA in a 1517-ball BGA package, offered in an industrial grade. It provides a large on-chip resource set—362,000 logic elements and approximately 19.8 Mbits of embedded memory—combined with 704 user I/O pins and a narrow core supply range of 1.07 V to 1.13 V. Designed for systems that require high-density programmable logic and wide I/O capability within an industrial temperature envelope, this device addresses demanding embedded, control, and processing tasks where RoHS compliance is required.
Key Features
- Core Logic 362,000 logic elements for implementing complex programmable logic and custom accelerators.
- Embedded Memory Approximately 19.8 Mbits of on-chip RAM to support buffering, state storage, and memory-intensive logic functions.
- I/O Capacity 704 user I/O pins to support dense external interfacing and multi-channel connectivity.
- Voltage Supply Core operating supply specified from 1.07 V to 1.13 V to match system power-rail requirements.
- Package & Mounting 1517-BBGA package (supplier device package: 1517-FBGA, 40×40) optimized for surface-mount applications.
- Industrial Temperature Range Rated for operation from −40 °C to 100 °C to meet industrial-environment requirements.
- Regulatory & Assembly RoHS-compliant construction for environmental and manufacturing compatibility.
Typical Applications
- Industrial Control and Automation — Industrial-grade temperature rating and abundant I/O make the device suitable for control logic, signal aggregation, and protocol bridging in factory and process automation systems.
- Communications and Networking — Large logic capacity and extensive I/O enable implementation of packet processing, framing, and interface adaptation functions in network equipment.
- High-Density Embedded Systems — Substantial on-chip RAM and logic resources support custom compute cores, data buffering, and real-time processing in embedded platforms.
Unique Advantages
- Substantial Logic Capacity: 362,000 logic elements provide the headroom for complex designs and multi-function implementations without immediately moving to larger families.
- Integrated Memory: Approximately 19.8 Mbits of embedded RAM reduces the need for external memory for many buffering and state-storage tasks, simplifying system BOM.
- Wide I/O Count: 704 user I/O pins support dense external connectivity for sensors, transceivers, and high-channel-count peripherals.
- Industrial-Grade Operation: −40 °C to 100 °C operating range supports deployment in harsh or temperature-variable environments.
- Compact BGA Packaging: 1517-ball BGA (supplier package 1517-FBGA, 40×40) enables surface-mount assembly in space-constrained board designs.
- Regulatory Compatibility: RoHS compliance eases environmental conformity and manufacturing acceptance.
Why Choose 5AGXBB3D4F40I5N?
This Arria V GX FPGA combines a high logic-element count and significant embedded memory with broad I/O capability and an industrial temperature rating, making it a practical choice for engineers building robust, programmable systems requiring on-board processing, dense interfacing, and long-term deployment in industrial environments. The device’s narrow core voltage window and surface-mount BGA packaging support controlled power-rail design and compact PCB integration.
Design teams targeting mid-to-high complexity FPGA implementations—where deterministic operation across a wide temperature range and RoHS-compliant manufacturing are required—will find the 5AGXBB3D4F40I5N well suited to reduce external components and consolidate functions into a single programmable device.
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