5AGXBB3D4F40I5N

IC FPGA 704 I/O 1517FBGA
Part Description

Arria V GX Field Programmable Gate Array (FPGA) IC 704 19822592 362000 1517-BBGA

Quantity 241 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1517-FBGA (40x40)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1517-BBGANumber of I/O704Voltage1.07 V - 1.13 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs17110Number of Logic Elements/Cells362000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits19822592

Overview of 5AGXBB3D4F40I5N – Arria V GX Field Programmable Gate Array (FPGA), 704 I/O, ~19.8 Mbits RAM

The 5AGXBB3D4F40I5N is an Intel Arria V GX FPGA in a 1517-ball BGA package, offered in an industrial grade. It provides a large on-chip resource set—362,000 logic elements and approximately 19.8 Mbits of embedded memory—combined with 704 user I/O pins and a narrow core supply range of 1.07 V to 1.13 V. Designed for systems that require high-density programmable logic and wide I/O capability within an industrial temperature envelope, this device addresses demanding embedded, control, and processing tasks where RoHS compliance is required.

Key Features

  • Core Logic 362,000 logic elements for implementing complex programmable logic and custom accelerators.
  • Embedded Memory Approximately 19.8 Mbits of on-chip RAM to support buffering, state storage, and memory-intensive logic functions.
  • I/O Capacity 704 user I/O pins to support dense external interfacing and multi-channel connectivity.
  • Voltage Supply Core operating supply specified from 1.07 V to 1.13 V to match system power-rail requirements.
  • Package & Mounting 1517-BBGA package (supplier device package: 1517-FBGA, 40×40) optimized for surface-mount applications.
  • Industrial Temperature Range Rated for operation from −40 °C to 100 °C to meet industrial-environment requirements.
  • Regulatory & Assembly RoHS-compliant construction for environmental and manufacturing compatibility.

Typical Applications

  • Industrial Control and Automation — Industrial-grade temperature rating and abundant I/O make the device suitable for control logic, signal aggregation, and protocol bridging in factory and process automation systems.
  • Communications and Networking — Large logic capacity and extensive I/O enable implementation of packet processing, framing, and interface adaptation functions in network equipment.
  • High-Density Embedded Systems — Substantial on-chip RAM and logic resources support custom compute cores, data buffering, and real-time processing in embedded platforms.

Unique Advantages

  • Substantial Logic Capacity: 362,000 logic elements provide the headroom for complex designs and multi-function implementations without immediately moving to larger families.
  • Integrated Memory: Approximately 19.8 Mbits of embedded RAM reduces the need for external memory for many buffering and state-storage tasks, simplifying system BOM.
  • Wide I/O Count: 704 user I/O pins support dense external connectivity for sensors, transceivers, and high-channel-count peripherals.
  • Industrial-Grade Operation: −40 °C to 100 °C operating range supports deployment in harsh or temperature-variable environments.
  • Compact BGA Packaging: 1517-ball BGA (supplier package 1517-FBGA, 40×40) enables surface-mount assembly in space-constrained board designs.
  • Regulatory Compatibility: RoHS compliance eases environmental conformity and manufacturing acceptance.

Why Choose 5AGXBB3D4F40I5N?

This Arria V GX FPGA combines a high logic-element count and significant embedded memory with broad I/O capability and an industrial temperature rating, making it a practical choice for engineers building robust, programmable systems requiring on-board processing, dense interfacing, and long-term deployment in industrial environments. The device’s narrow core voltage window and surface-mount BGA packaging support controlled power-rail design and compact PCB integration.

Design teams targeting mid-to-high complexity FPGA implementations—where deterministic operation across a wide temperature range and RoHS-compliant manufacturing are required—will find the 5AGXBB3D4F40I5N well suited to reduce external components and consolidate functions into a single programmable device.

Request a quote or submit a procurement inquiry to receive pricing and availability for the 5AGXBB3D4F40I5N.

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