5AGXBB3D6F31C6N

The 5AGXBB3D6F31C6N is an Arria V GX family FPGA in a 896-ball FCBGA package, offered as a commercial-grade surface-mount device. It provides a large logic fabric paired with substantial on-chip memory and a high I/O count, suited to designs that require reconfigurable logic, substantial embedded RAM, and board-level integration in a 31×31 FBGA footprint.

Key electrical envelope characteristics include a core supply range of 1.07 V to 1.13 V and an operating temperature range of 0 °C to 85 °C. The device is RoHS compliant.

Key Features

• Logic Capacity  Approximately 362,000 logic elements for implementing large, complex logic designs.
• Embedded Memory  Approximately 19.8 Mbits of on-chip RAM to support buffering, packet processing, and algorithm state storage.
• High I/O Count  384 I/Os to support wide external interfaces and parallel peripherals.
• Package & Mounting  896-BBGA (FCBGA) package, supplied in an 896-FBGA (31×31) format for surface-mount PCB assembly.
• Power Supply  Core voltage specified between 1.07 V and 1.13 V to match system power-rail planning.
• Commercial Temperature Grade  Rated for operation from 0 °C to 85 °C for commercial environment deployments.
• Standards Compliance  RoHS compliant, simplifying environmental compliance for assemblies.

Typical Applications

• High-density digital processing  Use the 362,000 logic elements to implement complex custom datapaths, protocol engines, or control logic.
• Memory-intensive functions  Leverage approximately 19.8 Mbits of embedded RAM for buffering, packet queues, or on-chip data tables.
• I/O-heavy systems  Deploy the 384 I/Os to interface with wide buses, parallel sensors, or multiple high-speed peripherals.
• Board-level integration  The 896-FBGA (31×31) surface-mount package enables compact PCB footprints for space-constrained designs.

Unique Advantages

• Large programmable fabric: The device’s extensive logic element count supports consolidation of multiple functions into a single FPGA, reducing component count.
• Substantial on-chip RAM: Approximately 19.8 Mbits of embedded memory reduces reliance on external memory for many buffering and state-storage tasks.
• High external connectivity: With 384 I/Os, the device accommodates designs that require broad peripheral and bus connectivity without gate-count compromises.
• Compact board footprint: The 896-FBGA (31×31) package enables high-density board layouts while maintaining robust I/O routing options.
• Defined power and thermal envelope: Specified core voltage range (1.07 V–1.13 V) and commercial operating temperature (0 °C–85 °C) assist system power and thermal planning.
• Regulatory readiness: RoHS compliance supports environmental regulatory requirements for assemblies.

Why Choose 5AGXBB3D6F31C6N?

The 5AGXBB3D6F31C6N delivers a balance of large logic capacity, significant embedded memory, and extensive I/O in a commercial-grade Arria V GX FPGA package. It is suited for customers consolidating multiple digital functions into a single programmable device while keeping board footprint and external memory requirements under control.

Engineers targeting reconfigurable designs that require predictable power and temperature envelopes, a high number of external I/Os, and RoHS compliance will find this device appropriate for a wide range of commercial applications.

Request a quote or submit a purchase inquiry to receive pricing, availability, and lead-time information for the 5AGXBB3D6F31C6N.