5AGXBB3D6F40C6G

The 5AGXBB3D6F40C6G is an Arria V GX Field Programmable Gate Array (FPGA) IC from Intel, offered in a commercial grade. This device integrates high logic density, substantial on‑chip memory, and a large I/O count in a 1517‑BBGA FCBGA package to support advanced programmable logic designs.

With 362,000 logic elements and approximately 19.8 Mbits of embedded memory, the device is suited for high‑capacity programmable implementations that require a high number of I/Os and a compact surface‑mount package.

Key Features

• Core Logic: 362,000 logic elements provide capacity for complex programmable logic and system integration on a single device.
• Embedded Memory: Approximately 19.8 Mbits of on‑chip RAM to support data buffering, local storage, and memory‑intensive logic functions.
• I/O Density: 704 I/Os to accommodate wide parallel interfaces, multiple peripherals, and dense board-level connectivity.
• Power Supply: Core voltage supply specified from 1.07 V to 1.13 V to define the operating power envelope for the FPGA core.
• Package & Mounting: 1517‑BBGA (FCBGA) package; supplier device package listed as 1517‑FBGA, FC (40×40); surface‑mount mounting type for standard PCB assembly.
• Operating Range: Commercial temperature range of 0 °C to 85 °C for typical system environments.
• RoHS Compliance: Device is RoHS compliant, supporting regulatory requirements for lead‑free manufacturing.

Typical Applications

• Programmable logic and prototyping: High logic element count and embedded memory enable complex prototypes and development platforms that require flexible hardware reconfiguration.
• High‑I/O system interfaces: The 704 I/Os are suitable for designs that need extensive external connectivity, parallel buses, or multi‑lane interfaces.
• Memory‑intensive functions: Approximately 19.8 Mbits of on‑chip RAM support local buffering, packet queues, and data‑path staging within the FPGA fabric.

Unique Advantages

• High integration density: 362,000 logic elements consolidate large design functions into a single FPGA, reducing PCB complexity and BOM count.
• Substantial on‑chip memory: Nearly 20 Mbits of embedded RAM allows for significant local storage, minimizing the need for external memory in many designs.
• Large I/O capability: 704 I/Os provide flexibility for interfacing numerous peripherals, sensors, and external logic without additional bridging devices.
• Standard surface‑mount packaging: 1517‑BBGA FCBGA package supports compact board layouts and established assembly processes.
• Commercial temperature suitability: Rated 0 °C to 85 °C for deployment in standard commercial applications and environments.
• Regulatory alignment: RoHS compliance supports environmentally conscious manufacturing requirements.

Why Choose 5AGXBB3D6F40C6G?

The 5AGXBB3D6F40C6G Arria V GX FPGA combines high logic element density, substantial embedded memory, and a high I/O count in a compact 1517‑BBGA surface‑mount package. It is positioned for commercial applications that require significant programmable logic capacity, extensive interfacing, and on‑chip memory resources within a defined core voltage and temperature envelope.

This device is suited to design teams needing a highly integrated FPGA platform that simplifies board‑level design and supports scalable, memory‑intensive functions while meeting RoHS requirements.

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