5AGXBB5D4F35C5G
| Part Description |
Arria V GX Field Programmable Gate Array (FPGA) IC 544 23625728 420000 1152-BBGA, FCBGA |
|---|---|
| Quantity | 260 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA, FC (35x35) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 544 | Voltage | 1.07 V - 1.13 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 158491 | Number of Logic Elements/Cells | 420000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 23625728 |
Overview of 5AGXBB5D4F35C5G – Arria V GX Field Programmable Gate Array (FPGA) IC 544 23625728 420000 1152-BBGA, FCBGA
The 5AGXBB5D4F35C5G is an Intel Arria V GX commercial-grade FPGA delivered in a 1152-ball FCBGA package. It provides a large programmable fabric with extensive I/O and on-chip memory for designs that require significant logic capacity and dense board-level integration.
Typical use cases include communications and network processing, compute acceleration, video and imaging pipelines, and complex prototyping where a combination of logic density, embedded memory, and a compact BGA footprint are required.
Key Features
- Core Logic Approximately 420,000 logic elements for implementing large, complex designs and custom processing pipelines.
- Embedded Memory Approximately 23.6 Mbits of on-chip RAM to support buffering, lookup tables, and intermediate data storage without external memory for many functions.
- I/O Density 544 I/O pins to support wide bus interfaces, parallel data paths, and multiple high-pin-count peripherals.
- Package & Mounting 1152-BBGA (FCBGA) package, supplier device package 1152-FBGA, FC (35×35); designed for surface-mount assembly to minimize board area.
- Power Supply Specified core voltage range of 1.07 V to 1.13 V for precise power planning and integration with regulated power rails.
- Operating Range & Grade Commercial-grade device rated for 0 °C to 85 °C operating temperature.
- Compliance RoHS compliant for adherence to standard environmental and manufacturing requirements.
Typical Applications
- Networking & Telecom Use the device’s large logic fabric and high I/O count for packet processing, protocol offload, and interface bridging.
- Compute Acceleration Implement custom hardware accelerators and data-path parallelism leveraging the extensive logic elements and embedded RAM.
- Video & Imaging Deploy programmable pipelines and frame buffering using the combination of logic density and on-chip memory.
- Prototyping & Development Evaluate and validate complex system designs that require a production-like FPGA footprint and significant resources.
Unique Advantages
- High logic capacity: Approximately 420,000 logic elements enable complex algorithms and multi-function designs on a single device, reducing the need for multiple FPGAs.
- Substantial embedded memory: Approximately 23.6 Mbits of RAM supports local buffering and state storage, lowering external memory dependency for many use cases.
- Dense I/O integration: 544 I/Os accommodate broad interface requirements and simplify board routing for signal-rich applications.
- Compact BGA packaging: 1152-ball FCBGA (35×35) package delivers a high-pin-count solution in a compact footprint suitable for space-constrained boards.
- Commercial temperature rating: Rated for 0 °C to 85 °C operation, aligned with commercial deployment environments and test conditions.
- RoHS compliant: Meets environmental manufacturing standards to support regulated production workflows.
Why Choose 5AGXBB5D4F35C5G?
The 5AGXBB5D4F35C5G Arria V GX FPGA combines a large programmable fabric, substantial embedded RAM, and a high I/O count within a compact 1152-BBGA package, making it suitable for designs that demand integration and resource density. Its specified core voltage range and commercial operating temperature make it straightforward to integrate into regulated board power and thermal envelopes.
Engineers and procurement teams looking for a commercial-grade FPGA with verified datasheet support for electrical characteristics, configuration, and I/O timing will find this device appropriate for complex prototyping, networking, compute acceleration, and imaging applications where on-chip resources reduce BOM complexity and speed time-to-market.
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