5AGXBB5D4F35I5G

The 5AGXBB5D4F35I5G is an Arria V GX field programmable gate array (FPGA) in an industrial-grade offering, delivering a high-density fabric with extensive on-chip memory and a large I/O complement. It is designed for applications that require substantial logic capacity, embedded memory, and a high pin count in a surface-mount BGA package.

Key value comes from the combination of 420,000 logic elements, approximately 23.6 Mbits of embedded memory, and 544 general-purpose I/Os—enabling complex, high-channel-count designs within the Arria V device family constraints documented in the provided datasheet.

Key Features

• Core Logic  420,000 logic elements (cells) provide a large fabric for implementing complex digital designs and high-density logic functions.
• Embedded Memory  Approximately 23.6 Mbits of on-chip RAM for buffering, lookup tables, and state storage without external memory dependency.
• I/O Capacity  544 I/Os to support high channel counts, wide buses, and multiple peripheral interfaces on a single device.
• Package & Mounting  1152-ball BGA (FCBGA) package; supplier device package listed as 1152-FBGA, FC (35×35). Designed for surface-mount assembly.
• Power  Core supply operating range specified from 1.07 V to 1.13 V, enabling integration into tightly constrained power domains.
• Temperature & Grade  Industrial grade device rated for operation from −40 °C to 100 °C for deployment in temperature-demanding environments.
• Standards Compliance  RoHS compliant.

Typical Applications

• High-density logic and DSP systems  Use the 420,000 logic elements and large embedded RAM to implement complex datapath processing and algorithm acceleration.
• Networking and communications  544 I/Os enable wide parallel interfaces, multi-lane connectivity, and protocol bridging in network equipment.
• Industrial control and automation  Industrial temperature rating and robust I/O make the device suitable for control systems, motion control, and multi-sensor aggregation.
• High-channel data aggregation  On-chip memory and abundant I/O support buffering and aggregation for high-channel telemetry, test, or acquisition systems.

Unique Advantages

• High logic capacity: 420,000 logic elements allow consolidation of multiple functions into a single FPGA, reducing system complexity.
• Substantial on-chip memory: Approximately 23.6 Mbits of embedded RAM minimizes external memory needs and simplifies board design.
• Large I/O complement: 544 I/Os provide flexibility for parallel interfaces and multi-channel connectivity without external I/O expanders.
• Industrial temperature range: Rated from −40 °C to 100 °C for dependable operation in demanding environments.
• High-density BGA package: 1152-ball FCBGA (35×35) delivers high pin count in a compact surface-mount form factor suitable for modern PCB assembly.
• Controlled core supply range: A defined 1.07–1.13 V core voltage window supports predictable power integration and design margins.

Why Choose 5AGXBB5D4F35I5G?

The 5AGXBB5D4F35I5G combines large logic capacity, significant embedded memory, and a high I/O count in a surface-mount 1152-ball BGA package, making it an effective choice for engineers consolidating complex digital systems onto a single FPGA. Its industrial temperature rating and RoHS compliance make it suitable for long-life, temperature-challenging applications.

This device fits designs that require scalability in logic and memory, high channel density, and a compact high-pin-count package. Use it where consolidating functionality, minimizing external components, and supporting robust operating conditions are priorities.

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