5AGXBB5D4F40C4N
| Part Description |
Arria V GX Field Programmable Gate Array (FPGA) IC 704 23625728 420000 1517-BBGA |
|---|---|
| Quantity | 1,660 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-FBGA (40x40) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA | Number of I/O | 704 | Voltage | 1.07 V - 1.13 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 19811 | Number of Logic Elements/Cells | 420000 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 23625728 |
Overview of 5AGXBB5D4F40C4N – Arria V GX FPGA, 420,000 logic elements, 1517-BBGA
The 5AGXBB5D4F40C4N is an Intel Arria V GX Field Programmable Gate Array (FPGA) supplied in a 1517-BBGA surface-mount package. It delivers a high logic capacity—420,000 logic elements—with approximately 23.63 Mbits of embedded memory and 704 I/Os for complex, high-density designs.
Designed as a commercial-grade device, this FPGA operates from 0 °C to 85 °C with a core supply range of 1.07 V to 1.13 V and is RoHS compliant. The part is provided in a 1517-FBGA (40×40) supplier device package for compact board-level integration.
Key Features
- Core Logic Capacity 420,000 logic elements to support large-scale, highly parallel digital designs and complex logic integration.
- Embedded Memory Approximately 23.63 Mbits of on-chip RAM for buffering, lookup tables, and state storage without external memory dependence.
- High I/O Count 704 user I/Os to accommodate dense peripheral interfacing, multi-channel connectivity, and wide parallel buses.
- Package & Mounting 1517-BBGA package; supplier device package listed as 1517-FBGA (40×40). Surface-mount mounting for standard PCB assembly workflows.
- Power and Operating Range Core voltage supply range 1.07 V–1.13 V; commercial-grade operating temperature from 0 °C to 85 °C.
- Compliance RoHS compliant, supporting regulatory requirements for lead-free assembly.
Typical Applications
- High-density digital designs Use where large logic capacity and abundant on-chip RAM are required to implement complex custom logic and state machines.
- Multi-interface bridging 704 I/Os enable consolidation of multiple parallel and serial interfaces onto a single FPGA device for board-level integration.
- Compact board designs 1517-FBGA (40×40) packaging and surface-mount mounting support space-constrained PCBs and commercial product assemblies.
Unique Advantages
- Large programmable fabric 420,000 logic elements provide the capacity to integrate extensive custom logic and multiple functions into one device, reducing BOM complexity.
- Substantial on-chip memory Approximately 23.63 Mbits of embedded RAM reduces reliance on external memory and simplifies timing and board design.
- Extensive I/O availability 704 I/Os give designers flexibility to connect numerous peripherals, sensors, or parallel interfaces without external multiplexing.
- Commercial temperature rating Specified for 0 °C to 85 °C operation to match a wide range of commercial product requirements.
- Compact FBGA packaging 1517-BBGA / 1517-FBGA (40×40) supports dense PCB layouts while enabling standard surface-mount assembly processes.
- Regulatory readiness RoHS compliance facilitates lead-free manufacturing and regulatory alignment for commercial products.
Why Choose 5AGXBB5D4F40C4N?
The 5AGXBB5D4F40C4N provides a combination of high logic density, significant on-chip RAM, and a large I/O count in a compact FBGA package—making it a strong choice for commercial designs that require consolidated functionality on a single FPGA. Its specified core voltage range and commercial temperature rating support predictable integration into production hardware.
For engineering teams focused on reducing system complexity and board-level component count, this Intel Arria V GX device delivers quantifiable resources and packaging suitable for demanding, space-efficient applications while remaining RoHS compliant.
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