5AGXBB5D4F35I5N

IC FPGA 544 I/O 1152FBGA
Part Description

Arria V GX Field Programmable Gate Array (FPGA) IC 544 23625728 420000 1152-BBGA, FCBGA Exposed Pad

Quantity 1,287 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1152-BBGA, FCBGA Exposed PadNumber of I/O544Voltage1.07 V - 1.13 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs19811Number of Logic Elements/Cells420000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits23625728

Overview of 5AGXBB5D4F35I5N – Arria V GX Field Programmable Gate Array (FPGA) IC, 420000 logic elements

The 5AGXBB5D4F35I5N is an Arria V GX Field Programmable Gate Array (FPGA) in a 1152-BBGA FCBGA exposed pad package, delivering a high-density programmable logic fabric with 420,000 logic elements. This industrial-grade device combines a large logic capacity with substantial embedded memory and a broad I/O count for complex system designs.

Key platform characteristics include approximately 23.63 Mbits of on-chip RAM, 544 user I/O pins, an industrial operating temperature range of –40 °C to 100 °C, and a tightly specified core voltage range of 1.07 V to 1.13 V. The device is RoHS compliant and intended for surface-mount assembly.

Key Features

  • Core Logic: 420,000 logic elements providing a large programmable fabric for complex logic implementation and custom hardware functions.
  • Embedded Memory: Approximately 23.63 Mbits of on-chip RAM to support buffering, packet processing, and embedded-data storage.
  • I/O Capacity: 544 programmable I/O pins enabling extensive external connectivity and interface options for peripherals and high-pin-count systems.
  • Package & Mounting: 1152-BBGA FCBGA exposed pad package (supplier device package: 1152-FBGA 35×35) designed for surface-mount PCB assembly and heat dissipation via exposed pad.
  • Power Requirements: Core voltage supply specified between 1.07 V and 1.13 V for predictable power planning and supply budgeting.
  • Industrial Grade & Temperature Range: Rated industrial grade with an operating temperature range of –40 °C to 100 °C for deployment in temperature-variable environments.
  • Regulatory Compliance: RoHS compliant for environmental and manufacturing compatibility.

Typical Applications

  • Custom Hardware Acceleration: Use the 420,000 logic elements and large embedded RAM to implement custom accelerators, data-path processing, and algorithm offload functions.
  • High‑Pin-Count System Integration: With 544 I/Os, the device supports designs that require extensive peripheral interfacing, wide buses, or multiple external components.
  • Industrial Control & Automation: Industrial-grade temperature rating (–40 °C to 100 °C) and robust package make it suitable for control systems and automation applications requiring long-term reliability.

Unique Advantages

  • Large Programmable Capacity: 420,000 logic elements provide the resource headroom to implement complex logic, state machines, and parallel processing functions without immediate migration.
  • Substantial On-Chip Memory: Approximately 23.63 Mbits of embedded RAM reduces external memory dependency for buffering and state storage, simplifying board-level design.
  • High I/O Count: 544 I/Os support dense external connectivity and enable multi-interface designs or wide parallel data paths.
  • Industrial Temperature Support: Rated from –40 °C to 100 °C, enabling deployment in environments with wide temperature fluctuations.
  • Predictable Power Envelope: Narrow core voltage range (1.07 V to 1.13 V) aids in power-supply design and thermal planning.
  • RoHS Compliant: Aligns with common manufacturing and environmental requirements.

Why Choose 5AGXBB5D4F35I5N?

The 5AGXBB5D4F35I5N Arria V GX FPGA balances high logic density, significant embedded memory, and a large I/O count in an industrial-grade, surface-mount BBGA package. These attributes make it well suited for designs that require substantial on-chip resources, predictable power requirements, and operation across a wide temperature range.

Designed for engineers and system integrators who need a programmable, high-capacity FPGA platform, this device offers a clear hardware resource profile to plan complex implementations and long-term deployments. Detailed electrical characteristics, switching performance, and configuration specifications are available in the Arria V device datasheet for design validation and system integration.

Request a quote or submit a procurement inquiry to get pricing and availability for 5AGXBB5D4F35I5N and to discuss delivery lead times or volume requirements.

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