5AGXBB5D4F35C4N

The 5AGXBB5D4F35C4N is an Arria V GX Field Programmable Gate Array (FPGA) offered in a 1152‑BBGA exposed‑pad package. This commercial‑grade, surface‑mount device provides high logic density, substantial embedded memory, and a large I/O count for complex programmable digital designs.

Key attributes include 420,000 logic elements, approximately 23.6 Mbits of embedded RAM, up to 544 I/O pins, and a core supply range of 1.07 V to 1.13 V. The device is specified for operation from 0 °C to 85 °C and is RoHS compliant.

Key Features

• Core Logic Capacity  420,000 logic elements suitable for large, high‑density FPGA implementations.
• Embedded Memory  Approximately 23.6 Mbits of on‑chip RAM to support complex buffering and state storage.
• I/O Density  544 I/O pins to enable extensive peripheral interfacing and board‑level connectivity.
• Package and Mounting  1152‑BBGA (FCBGA exposed pad) supplier device package; surface‑mount construction with a 35 × 35 mm footprint.
• Power  Core voltage specified between 1.07 V and 1.13 V for consistent power planning and regulator selection.
• Commercial Temperature Grade  Rated for 0 °C to 85 °C operation, aligning with commercial product deployments.
• Regulatory Compliance  RoHS compliant, supporting regulatory and assembly requirements.

Typical Applications

• High‑density FPGA designs  Designs that require a large logic resource pool and significant embedded RAM capacity.
• High‑I/O systems  Applications needing up to 544 I/Os for broad peripheral and board‑level interfacing.
• Commercial electronics  Deployments operating within the 0 °C to 85 °C range where commercial‑grade components are required.

Unique Advantages

• Substantial logic resources: 420,000 logic elements let you implement complex state machines, data paths, and custom logic without immediate partitioning across multiple devices.
• Significant on‑chip RAM: Approximately 23.6 Mbits of embedded memory reduces dependence on external memory for buffering and temporary storage.
• Large I/O complement: 544 I/Os provide flexibility for extensive interfacing and high pin‑count system designs.
• Predictable power envelope: Defined core voltage range (1.07 V–1.13 V) simplifies power‑supply design and verification.
• Board‑level packaging: 1152‑BBGA exposed‑pad package with a 35 × 35 mm supplier package footprint supports compact, surface‑mount PCB layouts.
• RoHS compliant: Conforms to lead‑free assembly requirements for commercial manufacturing environments.

Why Choose 5AGXBB5D4F35C4N?

The 5AGXBB5D4F35C4N Arria V GX FPGA combines a high logic element count, sizeable embedded RAM, and a broad I/O set in a compact 1152‑BBGA surface‑mount package. These characteristics make it a practical choice for commercial designs that need dense programmable logic, extensive on‑chip memory, and flexible interfacing while operating within a standard commercial temperature range.

This device is appropriate for teams and projects focused on integrating significant programmable functions into a single FPGA package, with clear electrical parameters (core voltage 1.07 V–1.13 V) and compliance considerations (RoHS) to streamline design and manufacturing planning.

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