5AGXBB3D6F35C6N

The 5AGXBB3D6F35C6N is an Intel Arria V GX Field Programmable Gate Array (FPGA) supplied in a 1152-BBGA exposed-pad package. It provides a high-density programmable logic fabric with a commercial-grade operating range and is intended for designs requiring substantial logic capacity, on-chip memory, and flexible I/O.

With a specified core supply window of 1.07 V to 1.13 V and an operating temperature range of 0 °C to 85 °C, this device is suitable for commercial embedded and board-level applications where integration density and I/O count are primary considerations.

Key Features

• Logic Capacity — 362,000 logic elements (logic cells) to implement complex digital designs and algorithms.
• Embedded Memory — Approximately 19.8 Mbits of on-chip RAM for data buffering, state storage, and intermediate processing.
• I/O Richness — 544 user I/Os to support broad external interfacing and multi-channel connectivity.
• Package — 1152-BBGA, FCBGA exposed pad (supplier package: 1152-FBGA (35×35)) for high pin count and thermal return.
• Power — Core voltage specified between 1.07 V and 1.13 V to match system power-rail requirements.
• Commercial Grade — Device grade specified as Commercial with an operating temperature range of 0 °C to 85 °C.
• Mounting — Surface-mount device suitable for PCB assembly with an exposed thermal pad for improved heat dissipation.
• RoHS Compliance — Environmentally compliant for regulated manufacturing processes.

Typical Applications

• High-density digital processing — Use the 362,000 logic elements and ~19.8 Mbits of embedded RAM to implement algorithmic processing, parallel datapaths, and control logic.
• Multi-channel I/O systems — 544 I/Os provide the connectivity needed for multiport interfaces, data aggregation, and peripheral control.
• Board-level programmable platforms — The 1152-BBGA package and exposed pad make the device suitable for compact, high-pin-count board designs requiring thermal management.

Unique Advantages

• Substantial logic density: 362,000 logic elements enable complex designs without immediate migration to larger device families.
• Significant on-chip memory: Approximately 19.8 Mbits of RAM reduces dependence on external memory for many buffering and state-storage needs.
• High I/O count: 544 I/Os allow flexible interfacing to multiple peripherals and subsystems, simplifying system partitioning.
• Commercial-grade readiness: Specified for 0 °C to 85 °C operation and RoHS compliance to match standard commercial production requirements.
• Thermal-aware package: The exposed-pad 1152-BBGA supports thermal conduction into the board for enhanced cooling in dense designs.
• Controlled core voltage: Narrow 1.07 V–1.13 V core supply range assists in predictable power design and regulator selection.

Why Choose 5AGXBB3D6F35C6N?

The 5AGXBB3D6F35C6N Arria V GX FPGA delivers a balance of logic capacity, embedded memory, and I/O density in a single commercial-grade package. Its combination of 362,000 logic elements and approximately 19.8 Mbits of on-chip RAM enables implementation of sophisticated digital functions while minimizing external components.

This device is well suited to engineers and procurement teams building compact, high-pin-count boards where thermal management and a high number of I/Os are required. The defined core voltage range and RoHS compliance make it straightforward to integrate into standard commercial production flows.

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