5AGXBB7D4F35C5G

IC FPGA 544 I/O 1152FBGA
Part Description

Arria V GX Field Programmable Gate Array (FPGA) IC 544 2975744 504140 1152-BBGA, FCBGA

Quantity 345 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package1152-FBGA, FC (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1152-BBGA, FCBGANumber of I/O544Voltage1.07 V - 1.13 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs23786Number of Logic Elements/Cells504140
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits2975744

Overview of 5AGXBB7D4F35C5G – Arria V GX FPGA, 504,140 Logic Elements, 544 I/O, 1152-BBGA

The 5AGXBB7D4F35C5G is an Arria V GX field programmable gate array (FPGA) offered as a commercial-grade device in a 1152-BBGA (FCBGA) package. It provides high logic density and substantial on-chip memory with a large I/O count for designs that require extensive programmable logic and connectivity.

This device is suited to designs that demand large programmable fabric, significant embedded RAM, and a compact surface-mount BGA package while operating within a commercial temperature range and standard core-voltage window.

Key Features

  • Logic Capacity — 504,140 logic elements providing high-density programmable fabric for complex logic and algorithm implementation; device listing also shows 23,786 CLBs.
  • Embedded Memory — Approximately 2.98 Mbits of on-chip RAM (2,975,744 total RAM bits) to support buffer, cache, and temporary storage requirements without external memory for many functions.
  • I/O Resources — 544 I/O pins to support multiple high-pin-count interfaces and system-level connectivity in a single device.
  • Power Envelope — Core voltage supply specified from 1.07 V to 1.13 V, enabling precise integration with regulated power domains.
  • Package & Mounting — 1152-BBGA (FCBGA) surface-mount package; supplier device package listed as 1152-FBGA, FC (35×35), suitable for dense board-level integration.
  • Commercial Grade & Temperature Range — Rated for commercial operation with an operating temperature range of 0 °C to 85 °C.
  • Environmental Compliance — RoHS compliant, supporting regulatory and manufacturing requirements for lead-free assembly.

Typical Applications

  • High-density logic systems — Implement complex control and signal-processing algorithms using the large logic element count and abundant CLBs.
  • Memory-intensive designs — Use the on-chip RAM to buffer data streams, implement FIFOs, or store intermediate datasets without immediate external memory dependence.
  • High-pin-count interface bridging — Support multiple parallel or serialized interfaces and system I/Os using 544 available I/O pins in a single FPGA package.
  • Compact commercial embedded systems — Integrate substantial programmable logic and I/O in a compact 1152-BBGA surface-mount package for space-constrained designs.

Unique Advantages

  • High logic integration: 504,140 logic elements provide the capacity to consolidate multiple functions into a single programmable device, reducing board-level component count.
  • Substantial on-chip RAM: Approximately 2.98 Mbits of embedded memory reduces reliance on external memory for many buffering and storage needs, simplifying BOM and layout.
  • Extensive I/O: 544 I/O pins enable flexible connectivity for multi-interface designs and high-density peripheral integration.
  • Compact BGA package: 1152-BBGA (35×35) delivers a high pin-count solution in a compact surface-mount form factor suited to modern PCB layouts.
  • Commercial readiness: Rated for 0 °C to 85 °C and RoHS compliant for mainstream commercial applications and manufacturing processes.
  • Controlled core-voltage range: Specified 1.07 V to 1.13 V core supply simplifies power-supply design and ensures operation within documented limits.

Why Choose 5AGXBB7D4F35C5G?

The 5AGXBB7D4F35C5G Arria V GX FPGA balances high logic density, ample embedded memory, and a large I/O complement in a single commercial-grade, surface-mount BGA package. It is positioned for designers who need to implement complex logic, handle substantial data buffering on-chip, and connect numerous interfaces without splitting functionality across multiple devices.

For engineering teams focused on scalability and consolidated designs, this device offers a predictable commercial operating range, RoHS compliance, and a compact package footprint to simplify board integration while delivering significant programmable resources.

Request a quote or submit an inquiry to receive pricing, availability, and ordering information for 5AGXBB7D4F35C5G. Provide your design requirements and quantity to get a tailored response.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up