5AGXBB7D4F35C5N

IC FPGA 544 I/O 1152FBGA
Part Description

Arria V GX Field Programmable Gate Array (FPGA) IC 544 27695104 504000 1152-BBGA, FCBGA Exposed Pad

Quantity 1,809 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1152-BBGA, FCBGA Exposed PadNumber of I/O544Voltage1.07 V - 1.13 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs23780Number of Logic Elements/Cells504000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits27695104

Overview of 5AGXBB7D4F35C5N – Arria V GX Field Programmable Gate Array (FPGA) IC

The 5AGXBB7D4F35C5N is an Intel Arria V GX field-programmable gate array supplied in a 1152-BBGA FCBGA exposed-pad package (1152-FBGA, 35×35). This commercial-grade FPGA delivers a very high logic capacity and on-chip memory density alongside a large programmable I/O count, supporting complex, integrated digital designs that require significant programmable resources.

Electrical and configuration characteristics for the Arria V family are documented in the device datasheet, which details operating conditions, switching and I/O timing, and configuration specifications for Arria V GX devices.

Key Features

  • High logic capacity — 504,000 logic elements provide substantial programmable resources for complex designs.
  • Logic block count — 23,780 logic blocks to structure and distribute logic across the device.
  • On-chip memory — Approximately 27.7 Mbits of embedded memory for large buffers, FIFOs, and state storage.
  • High I/O count — 544 I/O pins to support extensive peripheral, sensor, and high-density board connections.
  • Package and mounting — 1152-BBGA, FCBGA exposed pad package (supplier package: 1152-FBGA, 35×35) for surface-mount assembly and thermal/power routing.
  • Power requirements — Core supply range of 1.07 V to 1.13 V for system power planning.
  • Commercial temperature grade — Rated for 0 °C to 85 °C operation for standard commercial environments.
  • Compliance — RoHS-compliant for environmental and regulatory compatibility.
  • Documented device behavior — Arria V GX device datasheet includes electrical characteristics, switching specs, configuration timing, and I/O timing information to support design and validation.

Typical Applications

  • High-density embedded processing — Use when large amounts of programmable logic and on-chip RAM are required for compute-intensive or custom-accelerator functions.
  • Interface aggregation and protocol bridging — The 544 I/Os enable aggregation of multiple peripherals, interfaces, or sensor arrays into a single programmable device.
  • Signal processing and buffering — Large embedded memory and extensive logic resources support buffering, filtering, and streaming data tasks.

Unique Advantages

  • Substantial programmable resources: 504,000 logic elements allow complex functions to be implemented on a single device, reducing the need for multiple discrete ICs.
  • Large embedded memory: Approximately 27.7 Mbits of on-chip RAM supports large data sets and low-latency buffering without external memory for many use cases.
  • Extensive I/O connectivity: 544 I/O pins provide flexibility for dense board-level integration and multiple interface endpoints.
  • Industry-standard BGA packaging: 1152-BBGA (1152-FBGA, 35×35) enables compact, high-density PCB layouts and exposed-pad thermal conduction.
  • Design documentation: Comprehensive Arria V GX datasheet material on electrical, switching, and configuration specifications aids reliable implementation and validation.
  • RoHS compliant: Meets environmental compliance requirements for many commercial product lines.

Why Choose 5AGXBB7D4F35C5N?

The 5AGXBB7D4F35C5N Arria V GX FPGA combines very high logic capacity, substantial embedded memory, and a large I/O complement in a compact 1152-BBGA package. Its documented operating and configuration parameters simplify system-level power and thermal planning while supporting complex, integrated designs that demand programmable flexibility.

This part is suited to designers and teams building advanced embedded systems, compute accelerators, or data-path-intensive applications that need significant on-chip resources and broad connectivity within a commercially-rated temperature range.

If you would like pricing, availability, or a formal quote for 5AGXBB7D4F35C5N, submit a request or inquiry to initiate procurement and delivery details.

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