5AGXBB7D4F35I5N

The 5AGXBB7D4F35I5N is an Arria V GX field programmable gate array (FPGA) IC optimized for designs demanding high logic capacity, abundant I/O, and significant on-chip memory. With 504,000 logic elements and approximately 27.7 Mbits of embedded RAM, this device addresses complex digital processing, I/O aggregation, and memory-intensive FPGA functions.

Configured in a compact 1152-BBGA exposed-pad package and rated for industrial operation, the device supports designs that require wide I/O counts, stable low-voltage operation, and extended temperature tolerance.

Key Features

• High Logic Capacity — 504,000 logic elements provide large programmable fabric for complex logic, parallel processing, and custom acceleration tasks.
• Embedded Memory — Approximately 27.7 Mbits of on-chip RAM to support buffering, lookup tables, and data-path storage without external memory for many use cases.
• Extensive I/O — 544 user I/O pins enable broad connectivity and dense peripheral interfacing in a single device.
• Power Supply — Operates from a supply range of 1.07 V to 1.13 V, enabling deterministic core voltage requirements for system power planning.
• Package and Mounting — 1152-BBGA, FCBGA exposed pad (supplier package: 1152-FBGA, 35×35) in a surface-mount format for compact board-level integration.
• Industrial Temperature Range — Rated for −40 °C to 100 °C operation to meet extended-environment deployment needs.
• Regulatory — RoHS compliant to support lead-free manufacturing and environmental compliance.

Typical Applications

• Industrial Control Systems — Use the industrial temperature rating and 544 I/O to interface with sensors, actuators, and field I/O in factory automation and process control.
• Data Aggregation and Processing — Leverage 504,000 logic elements and large embedded RAM for protocol bridging, packet processing, and custom data-path acceleration.
• High-Density I/O Platforms — Suitable for systems requiring many parallel interfaces or custom I/O mixes because of the device's high pin count.
• Test and Measurement Equipment — Embedded memory and extensive logic resources support real-time signal processing and instrument control in harsh environments.

Unique Advantages

• Substantial Logic Resource: 504,000 logic elements enable consolidation of multiple functions onto a single FPGA, reducing board-level component count.
• Significant On-Chip Memory: Approximately 27.7 Mbits of embedded RAM supports large buffering and data manipulation without immediate dependency on external memory.
• High I/O Density: With 544 I/O pins, the device simplifies designs that require many parallel interfaces or mixed-signal front-ends.
• Industrial Reliability: Rated for −40 °C to 100 °C operation, making it appropriate for industrial environments with wide temperature swings.
• Compact Package Integration: The 1152-BBGA exposed-pad surface-mount package supports high-density PCB layouts while aiding thermal conduction at the board level.

Why Choose 5AGXBB7D4F35I5N?

The 5AGXBB7D4F35I5N positions itself as a high-capacity, industrial-grade FPGA suitable for designs that require a large programmable fabric, extensive on-chip memory, and a high count of I/O in a compact BGA package. Its defined core voltage range and RoHS compliance make it straightforward to integrate into controlled-power, lead-free manufacturing flows.

This device is well suited for engineering teams building industrial automation, data processing, and measurement systems that demand a balance of logic density, embedded RAM, and robust environmental tolerance.

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