5AGXBB7D6F35C6G

The 5AGXBB7D6F35C6G is an Arria V GX field programmable gate array (FPGA) IC manufactured by Intel. It provides a high-density programmable fabric with substantial on-chip memory and a large number of general-purpose I/Os for demanding digital designs.

This commercial-grade device targets designs that require significant logic capacity and extensive board-level connectivity, and it offers defined operating and supply ranges to support predictable power and thermal planning.

Key Features

• Core Logic Density — 504,140 logic elements to implement large, complex digital designs and integrate multiple functions on a single device.
• Embedded Memory — Approximately 2.98 Mbits of on-chip RAM (2,975,744 total RAM bits) for buffering, state storage, and local data processing.
• I/O Capacity — 544 I/O pins to support extensive external interfacing and parallel connectivity on dense PCBs.
• Package & Mounting — 1152-BBGA (FCBGA) package; supplier device package listed as 1152-FBGA, FC (35x35). Surface-mount construction for standard assembly processes.
• Power Supply — Core supply voltage specified between 1.07 V and 1.13 V to inform power delivery and decoupling design.
• Operating Range & Grade — Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Environmental Compliance — RoHS compliant.

Typical Applications

• High-density digital systems — Implement large combinational and sequential logic, custom controllers, and complex state machines using the device’s extensive logic element count.
• I/O-intensive interfaces — Build multi-protocol bridges, parallel data collectors, and board-level interface hubs leveraging 544 I/Os.
• Embedded memory-dependent designs — Use approximately 2.98 Mbits of on-chip RAM for buffering, FIFOs, and local data storage to reduce external memory requirements.
• Compact, high-pin-count assemblies — Deploy in space-constrained PCBs using the 1152-ball FCBGA package while retaining broad connectivity.

Unique Advantages

• Highly scalable logic capacity: 504,140 logic elements allow consolidation of multiple functions on a single FPGA, reducing system-level component count.
• Significant on-chip RAM: Approximately 2.98 Mbits of embedded memory supports local buffering and state retention without immediate reliance on external memory.
• Extensive external connectivity: 544 I/Os provide flexibility for dense sensor, interface, and peripheral connections.
• Predictable power planning: A defined core supply range of 1.07–1.13 V helps simplify power-supply design and decoupling strategies.
• Commercial deployment ready: Rated for 0 °C to 85 °C operation and RoHS compliant for mainstream electronic products.
• Compact BGA footprint: 1152-ball FCBGA (35×35) package enables high pin count in a compact board area for space-sensitive designs.

Why Choose 5AGXBB7D6F35C6G?

The 5AGXBB7D6F35C6G Arria V GX FPGA combines a very large logic fabric with substantial embedded memory and a high I/O count, making it well suited to complex digital systems that need integration, connectivity, and local data handling. Its defined supply and temperature ranges support predictable system design and qualification for commercial applications.

This device is appropriate for engineering teams building high-density, I/O-rich designs that benefit from consolidating functions onto a single, RoHS-compliant FPGA in a compact FCBGA package.

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