5AGXBB7D6F35C6N

The 5AGXBB7D6F35C6N is an Arria V GX field programmable gate array (FPGA) in a 1152-BBGA exposed pad package. It combines a high count of logic elements and substantial embedded RAM with a large I/O complement, making it suitable for designs that require significant on-chip logic and memory resources within a surface-mount package.

Targeted at commercial-grade applications, this device delivers integration for systems that need numerous I/Os, a wide on-chip memory capacity, and a defined operating voltage and temperature range for predictable deployment.

Key Features

• Logic Resources  504,000 logic elements to implement complex digital functions and custom hardware accelerators.
• Embedded Memory  Approximately 27.7 Mbits of embedded memory for buffering, frame storage, and mapped data structures.
• I/O Capacity  544 I/O pins to support wide parallel interfaces, multiple high-pin-count peripherals, or numerous signal domains.
• Power  Defined voltage supply range of 1.07 V to 1.13 V to align with system power-rail planning and regulator selection.
• Package & Mounting  1152-BBGA FCBGA exposed pad, supplier device package 1152-FBGA (35×35); surface mount for PCB assembly compatibility.
• Operating Range  Commercial operating temperature range of 0 °C to 85 °C for typical commercial deployments.
• Environmental Compliance  RoHS compliant for regulatory and assembly process requirements.

Typical Applications

• Data Processing and Acceleration  Use the large logic fabric and embedded memory for custom compute blocks, packet processing, or stream processing tasks that require on-chip resources.
• High-Density I/O Systems  The 544 I/O pins support multi-channel interfaces, wide parallel buses, and boards requiring many external connections.
• Video and Imaging Subsystems  On-chip memory and logic resources enable frame buffering, custom image pipelines, and protocol bridging in video applications.

Unique Advantages

• High Logic Capacity: 504,000 logic elements provide the headroom to implement complex custom logic without external ASICs.
• Substantial On-Chip Memory: Approximately 27.7 Mbits of embedded RAM reduces dependence on external memory for many buffering and storage needs.
• Extensive I/O: 544 I/Os enable integration with many peripherals and parallel interfaces, reducing the need for additional I/O expanders.
• Package and Assembly Ready: 1152-BBGA exposed pad and surface-mount mounting simplify PCB layout for thermal and mechanical integration.
• Predictable Power Envelope: A narrow operating voltage range (1.07 V–1.13 V) aids power-supply design and stability in system implementations.
• RoHS Compliant: Conforms to lead-free assembly requirements for commercial product manufacturing.

Why Choose 5AGXBB7D6F35C6N?

The 5AGXBB7D6F35C6N positions itself where substantial on-chip logic, embedded memory, and broad I/O capacity are required in a commercial-grade FPGA package. Its combination of 504,000 logic elements, approximately 27.7 Mbits of embedded RAM, and 544 I/Os delivers integration and scalability for systems that consolidate functions onto a single programmable device.

This device is well suited for engineers building high-density custom logic, multi-channel interface boards, or memory-intensive pipelines who need defined electrical and thermal characteristics (surface-mount 1152-BBGA, 1.07 V–1.13 V supply, 0 °C–85 °C operating range) and RoHS compliance for commercial manufacturing.

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