5AGXFA5H4F35C4N

The 5AGXFA5H4F35C4N is an Arria V GX Field Programmable Gate Array (FPGA) IC from Intel, supplied in a 1152-ball FCBGA exposed pad package. It delivers a high-density programmable logic fabric combined with substantial embedded memory and a large I/O count for complex digital designs.

With 190,000 logic elements, approximately 12.7 Mbits of embedded RAM, and 544 I/O, this commercial‑grade FPGA is suited to designs that require significant logic capacity, on‑chip buffering, and broad external connectivity while operating within standard commercial temperature and supply voltage ranges.

Key Features

• Core Logic: 190,000 logic elements provide substantial programmable fabric for implementing complex custom logic, state machines, and parallel datapaths.
• Embedded Memory: Approximately 12.7 Mbits of on‑chip RAM for frame buffers, lookup tables, and local data storage to support high‑throughput processing and low‑latency pipelines.
• I/O Density: 544 available I/O pins to enable comprehensive interfacing with peripherals, high‑speed transceivers, and multi‑lane buses.
• Power Supply Range: Operates from a core supply of 1.07 V to 1.13 V, enabling predictable power budgeting in system designs.
• Package & Mounting: 1152-BBGA (1152-FBGA, 35×35) with exposed pad and surface mount construction for compact board integration.
• Operating Conditions: Commercial temperature rating from 0 °C to 85 °C, suitable for standard commercial applications.
• Environmental Compliance: RoHS compliant to support regulatory requirements for lead‑free assembly.

Typical Applications

• Networking & Data Communications: High I/O count and substantial logic elements support packet processing, protocol bridging, and custom interface implementations.
• Signal Processing & Acceleration: Large embedded RAM and dense logic fabric enable implementation of DSP pipelines, FIR/IIR filters, and acceleration blocks for compute‑intensive tasks.
• Custom Compute & Control: Programmable logic and generous I/O allow tailored control systems, hardware accelerators, and glue logic for complex electronics.
• Prototyping & Development: Offers the capacity to prototype large FPGA designs that require scalable logic, memory, and I/O resources within a commercial product envelope.

Unique Advantages

• High Logic Capacity: 190,000 logic elements provide headroom for large, parallelized designs and complex state machines without immediate redesign.
• Substantial On‑Chip Memory: Approximately 12.7 Mbits of embedded RAM reduces external memory dependencies and improves data locality for lower latency.
• Extensive I/O Connectivity: 544 I/O pins enable flexible interfacing options and simplify integration with multi‑lane or multi‑device systems.
• Compact Package Integration: 1152‑ball FCBGA exposed pad package supports dense board layouts and thermal conduction through the exposed pad.
• Commercial Temperature Suitability: Rated 0 °C to 85 °C for deployments in standard commercial environments where controlled ambient conditions are expected.
• RoHS Compliance: Conforms to RoHS requirements for lead‑free manufacturing and regulatory compatibility.

Why Choose 5AGXFA5H4F35C4N?

The 5AGXFA5H4F35C4N Arria V GX FPGA balances high logic density, meaningful on‑chip RAM, and a large I/O footprint in a compact FCBGA package, making it a solid choice for commercial designs that require integrated programmable logic and substantial interfacing. Its defined supply and temperature ranges allow predictable system-level integration and power planning.

This device is well suited to engineering teams building high‑throughput digital designs, protocol adapters, and custom accelerators that benefit from on‑chip memory and extensive I/O. The combination of capacity and package density supports scalable designs that can be adapted as requirements evolve.

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