5AGXFA5H4F35I3G

IC FPGA 544 I/O 1152FBGA
Part Description

Arria V GX Field Programmable Gate Array (FPGA) IC 544 13284352 190000 1152-BBGA, FCBGA Exposed Pad

Quantity 84 Available (as of May 6, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1152-BBGA, FCBGA Exposed PadNumber of I/O544Voltage1.12 V - 1.18 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs8962Number of Logic Elements/Cells190000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits13284352

Overview of 5AGXFA5H4F35I3G – Arria V GX Field Programmable Gate Array (FPGA) IC

The 5AGXFA5H4F35I3G is an Intel Arria V GX FPGA in an industrial-grade surface-mount package. It provides high on-chip logic capacity and embedded memory with a substantial I/O count, making it suitable for designs that require dense programmable logic, significant internal RAM, and broad external connectivity.

Key electrical and environmental parameters include a core supply range of 1.12 V to 1.18 V and an operating temperature range of −40 °C to 100 °C, with RoHS compliance and an exposed-pad 1152-BBGA (35×35) package for thermal and board-level integration.

Key Features

  • High Logic Capacity  Approximately 190,000 logic elements to implement large custom digital designs and complex processing pipelines.
  • Embedded Memory  Approximately 12.7 Mbits of on-chip RAM for data buffering, lookup tables, and state storage without external memory in many use cases.
  • Extensive I/O  544 programmable I/O pins to support broad peripheral interfacing and multichannel connectivity requirements.
  • Package and Mounting  1152-BBGA, FCBGA exposed-pad package (supplier device package: 1152-FBGA, 35×35) designed for surface-mount assembly and board-level thermal conduction.
  • Industrial Temperature Range  Rated for −40 °C to 100 °C operation, supporting deployments in a wide range of environmental conditions.
  • Optimized Core Power  Core voltage supply specified between 1.12 V and 1.18 V to align with system power budgets and core performance targets.
  • Standards and Compliance  RoHS-compliant construction to meet regulatory requirements for electronics manufacturing.

Typical Applications

  • Complex digital systems  Use the 190,000 logic elements and 12.7 Mbits of embedded RAM to implement large-scale custom logic, data processing engines, and control algorithms.
  • High-density I/O aggregation  With 544 I/Os, consolidate multiple peripheral interfaces or sensor channels on a single FPGA for streamlined system design.
  • Industrial control and instrumentation  Industrial-grade temperature rating and rugged packaging make it suitable for demanding control, monitoring, and automation applications.

Unique Advantages

  • Significant on-chip resources: The combination of approximately 190,000 logic elements and ~12.7 Mbits of RAM reduces reliance on external components and shortens signal paths.
  • High I/O count: 544 I/Os enable direct connection to many peripherals and parallel interfaces without complex multiplexing.
  • Industrial readiness: Rated for −40 °C to 100 °C operation and supplied in an exposed-pad BBGA to support thermal management in industrial environments.
  • Compact, board-friendly package: The 1152-BBGA (35×35) FCBGA package supports surface-mount assembly and provides a dense footprint for high-performance boards.
  • Controlled core supply: Narrow core voltage range (1.12 V–1.18 V) helps maintain predictable power characteristics for system-level power planning.

Why Choose 5AGXFA5H4F35I3G?

The 5AGXFA5H4F35I3G Arria V GX FPGA balances large programmable logic capacity, substantial embedded memory, and a high I/O count in an industrial-grade, surface-mount BBGA package. It is positioned for designs that need consolidated digital logic, significant on-chip buffering, and robust environmental tolerance.

For engineering teams focused on scalability and integration, this FPGA provides verifiable on-chip resources and thermal/packaging characteristics that simplify board design and system planning while maintaining regulatory compliance through RoHS alignment.

Request a quote or submit a product inquiry to obtain pricing, availability, and ordering information for part number 5AGXFA5H4F35I3G.

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