5AGXFA5H4F35I3G
| Part Description |
Arria V GX Field Programmable Gate Array (FPGA) IC 544 13284352 190000 1152-BBGA, FCBGA Exposed Pad |
|---|---|
| Quantity | 84 Available (as of May 6, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA Exposed Pad | Number of I/O | 544 | Voltage | 1.12 V - 1.18 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 8962 | Number of Logic Elements/Cells | 190000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 13284352 |
Overview of 5AGXFA5H4F35I3G – Arria V GX Field Programmable Gate Array (FPGA) IC
The 5AGXFA5H4F35I3G is an Intel Arria V GX FPGA in an industrial-grade surface-mount package. It provides high on-chip logic capacity and embedded memory with a substantial I/O count, making it suitable for designs that require dense programmable logic, significant internal RAM, and broad external connectivity.
Key electrical and environmental parameters include a core supply range of 1.12 V to 1.18 V and an operating temperature range of −40 °C to 100 °C, with RoHS compliance and an exposed-pad 1152-BBGA (35×35) package for thermal and board-level integration.
Key Features
- High Logic Capacity Approximately 190,000 logic elements to implement large custom digital designs and complex processing pipelines.
- Embedded Memory Approximately 12.7 Mbits of on-chip RAM for data buffering, lookup tables, and state storage without external memory in many use cases.
- Extensive I/O 544 programmable I/O pins to support broad peripheral interfacing and multichannel connectivity requirements.
- Package and Mounting 1152-BBGA, FCBGA exposed-pad package (supplier device package: 1152-FBGA, 35×35) designed for surface-mount assembly and board-level thermal conduction.
- Industrial Temperature Range Rated for −40 °C to 100 °C operation, supporting deployments in a wide range of environmental conditions.
- Optimized Core Power Core voltage supply specified between 1.12 V and 1.18 V to align with system power budgets and core performance targets.
- Standards and Compliance RoHS-compliant construction to meet regulatory requirements for electronics manufacturing.
Typical Applications
- Complex digital systems Use the 190,000 logic elements and 12.7 Mbits of embedded RAM to implement large-scale custom logic, data processing engines, and control algorithms.
- High-density I/O aggregation With 544 I/Os, consolidate multiple peripheral interfaces or sensor channels on a single FPGA for streamlined system design.
- Industrial control and instrumentation Industrial-grade temperature rating and rugged packaging make it suitable for demanding control, monitoring, and automation applications.
Unique Advantages
- Significant on-chip resources: The combination of approximately 190,000 logic elements and ~12.7 Mbits of RAM reduces reliance on external components and shortens signal paths.
- High I/O count: 544 I/Os enable direct connection to many peripherals and parallel interfaces without complex multiplexing.
- Industrial readiness: Rated for −40 °C to 100 °C operation and supplied in an exposed-pad BBGA to support thermal management in industrial environments.
- Compact, board-friendly package: The 1152-BBGA (35×35) FCBGA package supports surface-mount assembly and provides a dense footprint for high-performance boards.
- Controlled core supply: Narrow core voltage range (1.12 V–1.18 V) helps maintain predictable power characteristics for system-level power planning.
Why Choose 5AGXFA5H4F35I3G?
The 5AGXFA5H4F35I3G Arria V GX FPGA balances large programmable logic capacity, substantial embedded memory, and a high I/O count in an industrial-grade, surface-mount BBGA package. It is positioned for designs that need consolidated digital logic, significant on-chip buffering, and robust environmental tolerance.
For engineering teams focused on scalability and integration, this FPGA provides verifiable on-chip resources and thermal/packaging characteristics that simplify board design and system planning while maintaining regulatory compliance through RoHS alignment.
Request a quote or submit a product inquiry to obtain pricing, availability, and ordering information for part number 5AGXFA5H4F35I3G.

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