5AGXFA5H4F35I3

The 5AGXFA5H4F35I3 is an Intel Arria V GX Field Programmable Gate Array (FPGA) supplied in a 1152-BBGA FCBGA exposed pad package. It provides a high-density programmable fabric with 190,000 logic elements and 13,284,352 total on-chip RAM bits, addressing demanding programmable-logic requirements.

Designed for commercial and industrial applications, this device combines large logic capacity, substantial embedded memory, and a high I/O count (544 I/O) with an industrial operating temperature range and a narrow core voltage supply range for controlled power delivery.

Key Features

• Core Logic — 190,000 logic elements (logic cells) to implement complex programmable logic and custom hardware functions.
• Embedded Memory — 13,284,352 total RAM bits (approximately 13.3 Mbits) of on-chip memory for buffering, state storage, and data processing.
• I/O Capacity — 544 general-purpose I/O pins to support dense external connectivity and interface integration.
• Power and Supply — Core voltage supply specified at 1.12 V to 1.18 V for predictable core power requirements.
• Package and Mounting — 1152-BBGA, FCBGA exposed pad package in a 35 × 35 format, supplied for surface-mount assembly.
• Temperature and Grade — Rated industrial grade with an operating temperature range of −40 °C to 100 °C for extended-environment deployments.
• Regulatory Compliance — RoHS-compliant material status to support lead-free manufacturing processes.

Typical Applications

• Commercial systems — Programmable logic for custom functionality and rapid time-to-market in commercial electronic products.
• Industrial automation — Control and processing functions that benefit from the device’s industrial temperature rating and high I/O count.
• Embedded and prototyping platforms — Development of complex hardware accelerators and system prototypes leveraging large logic and on-chip memory resources.

Unique Advantages

• High logic density: 190,000 logic elements enable implementation of large, feature-rich FPGA designs without immediate need for multiple devices.
• Substantial embedded memory: 13,284,352 RAM bits provide on-chip storage for buffering, FIFOs, and state machines, reducing external memory dependence.
• Extensive I/O: 544 I/O pins support complex external interfacing and high pin-count peripherals directly on the FPGA.
• Industrial robustness: −40 °C to 100 °C operating range and industrial grade classification support deployment in demanding environments.
• Compact, assembly-ready package: 1152-BBGA FCBGA exposed pad package optimized for surface-mount production and thermal management.
• Controlled core power window: Specified 1.12 V to 1.18 V supply simplifies power-system design for the FPGA core.

Why Choose 5AGXFA5H4F35I3?

The 5AGXFA5H4F35I3 Arria V GX FPGA balances high logic capacity, significant embedded memory, and large I/O density in a compact 1152-BBGA FCBGA exposed pad package. Its industrial temperature rating and RoHS compliance make it suited for designs that require durability and manufacturability while maintaining a focused core supply window for predictable power design.

This device is appropriate for engineers and product teams building commercial and industrial programmable solutions that demand on-chip resources and extensive external connectivity, providing scalability and integration for medium- to high-complexity FPGA implementations.

Request a quote or submit an inquiry for pricing and availability to evaluate the 5AGXFA5H4F35I3 for your next programmable-logic design.