5AGXFA5H4F35I3N

The 5AGXFA5H4F35I3N is an Arria V GX field programmable gate array (FPGA) IC providing high-density programmable logic with 190,000 logic elements and approximately 13.28 Mbits of embedded memory. Its 544 user I/Os and compact 1152-BBGA / 1152-FBGA (35×35) exposed-pad package support complex, I/O‑rich designs in a surface-mount form factor.

Built to industrial-grade specifications, this device operates from a 1.12 V to 1.18 V core supply and across an operating temperature range of −40 °C to 100 °C. It is RoHS compliant and packaged for system-level assembly and deployment.

Key Features

• High Logic Capacity  190,000 logic elements enable implementation of large-scale, reconfigurable digital designs.
• Embedded Memory  Approximately 13.28 Mbits of on-chip RAM for data buffering, lookup tables, and state storage within the programmable fabric.
• Extensive I/O  544 general-purpose I/O pins provide broad connectivity for peripherals, sensors, and external interfaces.
• Power Supply  Core voltage requirement of 1.12 V to 1.18 V for integration with regulated power systems.
• Package and Mounting  1152‑BBGA / 1152‑FBGA (35×35) exposed‑pad package in a surface‑mount configuration suitable for high‑density PCB assembly.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C to meet demanding environmental conditions.
• Compliance  RoHS compliant for restricted-substance conformance in manufacturing.

Unique Advantages

• Large programmable fabric: 190,000 logic elements provide the capacity to consolidate multiple functions into a single FPGA, simplifying BOM and board complexity.
• Significant on-chip memory: Approximately 13.28 Mbits of embedded RAM supports data-intensive processing and local buffering requirements.
• High I/O density: 544 I/Os enable direct interfacing with a wide range of external devices without extensive external multiplexing.
• Industrial readiness: Specified operating range of −40 °C to 100 °C and industrial grading align with harsher deployment environments.
• Compact, assembly-friendly package: The 1152‑BBGA / 1152‑FBGA exposed‑pad surface-mount package supports high‑density PCB integration.
• Regulatory alignment: RoHS compliance supports environmentally conscious manufacturing and supply-chain requirements.

Why Choose 5AGXFA5H4F35I3N?

The 5AGXFA5H4F35I3N Arria V GX FPGA combines substantial logic resources, on‑chip memory, and a high I/O count in a compact surface‑mount FBGA package, making it suitable for designers who require a reconfigurable, high‑density logic solution with industrial operating margins. Its specified core voltage range and wide temperature rating support integration into tightly constrained system power and thermal designs.

This device is well suited to projects that demand scalable programmable logic capacity and reliable operation across a wide temperature range while meeting RoHS requirements. Its package and I/O complement designs where board space and connectivity are primary considerations.

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