5AGXFA5H6F35C6G

The 5AGXFA5H6F35C6G is an Intel Arria V GX field-programmable gate array (FPGA) supplied in a 1152‑BBGA (FCBGA) package. This commercial‑grade device provides a high logic density architecture with a broad I/O complement and substantial on-chip RAM for implementing complex, programmable digital systems.

Designed for surface-mount applications, the device operates from a core supply range of 1.07 V to 1.13 V and across a commercial temperature range of 0 °C to 85 °C, making it suitable for a variety of mainstream embedded and system‑level designs.

Key Features

• High Logic Density — 190,000 logic elements to implement large, complex logic designs and partitioned hardware functions.
• Embedded Memory — Approximately 13.3 Mbits of on‑chip RAM to support buffering, lookup tables, and local data storage for high‑throughput designs.
• Extensive I/O — 544 I/O pins for broad external connectivity, enabling dense peripheral and interface integration.
• Package & Mounting — 1152‑BBGA (FCBGA) package; supplier package listed as 1152‑FBGA, FC (35×35); surface mount for standard PCB assembly flows.
• Power — Core voltage supply specified between 1.07 V and 1.13 V to match targeted power-supply designs.
• Commercial Grade & Temperature Range — Commercial grade device rated for operation from 0 °C to 85 °C.
• Environmental Compliance — RoHS‑compliant for global electronics manufacturing requirements.

Typical Applications

• Programmable Logic Integration — Implement custom digital logic, state machines, and glue‑logic for system prototypes and production units.
• Data Buffering and Processing — Use embedded RAM and high logic capacity for packet buffering, stream processing, and intermediate data handling.
• High‑Pin Count Interface Designs — Leverage 544 I/Os to integrate multiple peripherals, memory interfaces, and custom I/O protocols on a single device.

Unique Advantages

• Large Logic Resource — 190,000 logic elements provide the headroom to consolidate multiple functions into a single FPGA, reducing BOM and board area.
• Substantial On‑Chip RAM — Approximately 13.3 Mbits of embedded memory helps minimize external memory dependence and improves data locality.
• High I/O Count — 544 I/Os simplify board-level routing and enable direct connections to multiple subsystems without external multiplexing.
• Industry‑standard Package — 1152‑BBGA (35×35) package supports reliable, high‑density PCB assembly and thermal behavior consistent with surface‑mount designs.
• Commercial Temperature Rating — Rated for 0 °C to 85 °C, suitable for mainstream electronics and controlled‑environment systems.
• Regulatory Readiness — RoHS compliance supports environmentally conscious manufacturing and distribution.

Why Choose 5AGXFA5H6F35C6G?

The 5AGXFA5H6F35C6G Arria V GX FPGA balances high logic capacity, significant embedded RAM, and a wide I/O set in a single commercial‑grade, surface‑mount package. It is well suited for designers seeking to consolidate complex logic, buffering, and multiple interfaces into a compact FPGA solution while meeting RoHS requirements.

This part is aimed at projects that require substantial programmable resources and flexible I/O in a dependable commercial temperature range, offering a scalable platform for development and production builds where integration and on‑chip memory are priorities.

Request a quote or submit a purchasing enquiry to obtain pricing, lead time, and availability for the 5AGXFA5H6F35C6G Arria V GX FPGA.