5AGXFA5H4F35I5NGA

IC FPGA 544 I/O 1152FBGA
Part Description

Arria V GX Field Programmable Gate Array (FPGA) IC 544 13284352 190000 1152-BBGA, FCBGA

Quantity 1,210 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1152-FBGA, FC (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1152-BBGA, FCBGANumber of I/O544Voltage1.07 V - 1.13 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs8962Number of Logic Elements/Cells190000
Number of GatesN/AECCNOBSOLETEHTS Code0000.00.0000
QualificationN/ATotal RAM Bits13284352

Overview of 5AGXFA5H4F35I5NGA – Arria V GX Field Programmable Gate Array (FPGA) IC

The Intel Arria V GX FPGA 5AGXFA5H4F35I5NGA is a high-density, industrial-grade programmable logic device designed for complex, I/O‑intensive embedded systems. With 190,000 logic elements, approximately 13.3 Mbits of embedded RAM and 544 I/O pins in a 1152‑BBGA (FCBGA) package, it addresses applications that require large logic capacity, substantial on‑chip memory and extensive external connectivity.

Rated for industrial operation and a core voltage supply range of 1.07 V to 1.13 V, this device is intended for designs that need robust thermal and electrical operating margins across –40 °C to 100 °C.

Key Features

  • High Logic Density — 190,000 logic elements and 8,962 CLBs provide significant programmable logic resources for large-scale digital designs.
  • On‑Chip Memory — Total RAM bits: 13,284,352, offering approximately 13.3 Mbits of embedded memory for buffering, lookup tables and data storage.
  • Extensive I/O — 544 I/O pins support complex interfacing and parallel connectivity with external peripherals and subsystems.
  • Industrial Grade Thermal Range — Specified operating temperature from –40 °C to 100 °C for deployment in industrial environments.
  • Precise Core Voltage — Core supply specified between 1.07 V and 1.13 V for reliable operation within defined electrical margins.
  • Compact BGA Package — Available in a 1152‑BBGA (FCBGA) / 1152‑FBGA, FC (35×35) supplier package for surface‑mount PCB assembly.
  • RoHS Compliant — Conforms to RoHS environmental requirements.

Typical Applications

  • Industrial Control and Automation — Large logic and memory resources enable complex control algorithms, deterministic I/O handling and real‑time signal processing in industrial systems.
  • High‑Density I/O Systems — The 544 I/O count supports multi‑channel data acquisition, interface bridging and extensive peripheral connectivity.
  • Embedded Networking and Communications — Dense logic and on‑chip RAM support packet processing, buffering and protocol handling in networking equipment.
  • Prototyping and System Development — The device’s capacity makes it suitable for validating large digital designs and accelerating hardware/software integration efforts.

Unique Advantages

  • Scalable Logic Resources: High logic element count and thousands of CLBs scale to complex designs without immediate partitioning to multiple devices.
  • Substantial On‑Chip Memory: Approximately 13.3 Mbits of embedded RAM reduces the need for external memory in many buffering and storage use cases.
  • High I/O Density: 544 I/O pins simplify board routing for parallel interfaces and multi‑lane systems, reducing external I/O expanders.
  • Industrial Temperature Specified: –40 °C to 100 °C rating supports deployment in harsher operating environments.
  • Compact Surface‑Mount Package: 1152‑BBGA (FCBGA) packaging balances board area efficiency with high pin count for dense system designs.
  • Controlled Core Supply: Tight core voltage range (1.07 V–1.13 V) helps designers meet power delivery and timing stability requirements.

Why Choose 5AGXFA5H4F35I5NGA?

The Intel Arria V GX 5AGXFA5H4F35I5NGA delivers a balance of large programmable logic capacity, significant embedded memory and a high I/O count in an industrial‑rated FPGA package. It is well suited for engineers and system designers who require a single‑device solution for complex control, processing and interfacing tasks while maintaining board area efficiency with a high‑pin‑count BGA footprint.

Backed by Intel’s device family documentation and industrial temperature grading, this FPGA is appropriate for long‑lifecycle industrial applications that need scalable logic, on‑chip memory and robust I/O capability.

Request a quote or submit an inquiry for pricing and availability to evaluate the 5AGXFA5H4F35I5NGA for your next design.

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