5AGXFA5H4F35I5G

The 5AGXFA5H4F35I5G is an Arria V GX field programmable gate array (FPGA) IC offering high logic density and substantial embedded memory in a ball grid array package. This device integrates 190,000 logic elements, approximately 13.3 Mbits of on‑chip RAM, and 544 general-purpose I/Os to address designs that require programmable logic, significant local memory, and broad external interfacing.

Designed for surface-mount assembly and an industrial operating range, the device operates from a core supply of 1.07 V to 1.13 V and is specified for −40 °C to 100 °C ambient operation, supporting deployment in systems that require extended temperature capability and robust integration.

Key Features

• Logic Capacity  Provides 190,000 logic elements to implement complex digital logic, custom datapaths, and control functions.
• Embedded Memory  Approximately 13.3 Mbits of on‑chip RAM for buffering, lookup tables, and state storage without external memory for many tasks.
• I/O Density  544 user I/Os to connect numerous peripherals, high-speed interfaces, or multiple parallel data channels.
• Power Supply  Core voltage range of 1.07 V to 1.13 V for defined power planning and supply sequencing in system designs.
• Package & Mounting  1152‑BBGA (FCBGA) package; supplier package listed as 1152‑FBGA, FC (35×35 mm), optimized for surface‑mount PCB assembly.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C, enabling use in temperature-challenging environments.
• Regulatory Status  RoHS compliant for materials and manufacturing processes.

Typical Applications

• High-density I/O systems  Use the device’s 544 I/Os to interface multiple sensors, transceivers, or parallel data streams in communication and instrumentation equipment.
• Memory-centric processing  Leverage approximately 13.3 Mbits of embedded RAM for local buffering, packet memory, or algorithm state storage in real‑time processing tasks.
• Industrial control and automation  Deploy in control systems that require extended temperature operation and substantial programmable logic for motor control, safety interlocks, and protocol handling.

Unique Advantages

• High logic density: 190,000 logic elements enable consolidation of multiple functions into a single FPGA, reducing board-level component count.
• Large on-chip memory: Approximately 13.3 Mbits of embedded RAM supports local data storage and reduces reliance on external memory devices.
• Extensive I/O capability: 544 I/Os provide flexibility to connect many peripherals, sensors, and interfaces without additional bridging components.
• Industrial temperature rating: −40 °C to 100 °C operation supports deployments in harsher environments where extended temperature tolerance is required.
• Compact BGA package: The 1152‑BBGA (supplier 1152‑FBGA, 35×35) footprint supports high‑density PCB layouts and surface‑mount assembly workflows.
• Defined core supply range: A 1.07 V to 1.13 V supply window simplifies power budgeting and sequencing for the FPGA core.

Why Choose 5AGXFA5H4F35I5G?

The 5AGXFA5H4F35I5G Arria V GX FPGA combines substantial logic capacity, significant embedded memory, and a very large I/O count in an industrial‑rated, surface‑mount BGA package. Its specification set—190,000 logic elements, approximately 13.3 Mbits of RAM, 544 I/Os, and an operating range of −40 °C to 100 °C—positions the device for system designs that need programmable integration, local memory resources, and robust thermal tolerance.

This FPGA is suited to engineers and OEMs implementing complex control, data‑path, or interface‑heavy designs who require a single, integrated programmable device to consolidate functions, simplify BOM, and support extended temperature operation.

Request a quote or submit a pricing and availability inquiry to begin integrating 5AGXFA5H4F35I5G into your designs.