5AGXFA7H4F35C4N

The 5AGXFA7H4F35C4N is an Arria V GX Field Programmable Gate Array (FPGA) IC from Intel, offered as a commercial‑grade device for board‑level integration. It delivers high logic density, substantial on‑chip embedded memory, and a large I/O count in a ball‑grid package suited for surface‑mount assemblies.

Designed for commercial applications that require flexible, programmable logic capacity, this device provides a balance of integration and I/O connectivity while operating from a low core voltage and within a standard commercial temperature range.

Key Features

• Core Logic Capacity  Provides 242,000 logic elements to implement complex digital designs and parallel compute structures.
• Logic Blocks  Approximately 11,460 logic blocks for structured logic partitioning and resource planning.
• Embedded Memory  Approximately 15.47 Mbits of on‑chip RAM to support buffering, state storage, and local data structures without external memory.
• I/O Density  Up to 544 user I/Os to interface with peripherals, sensors, and board‑level subsystems.
• Power and Core Voltage  Core supply range of 1.07 V to 1.13 V for consistent power budgeting and thermal analysis.
• Package and Mounting  1152‑BBGA (FCBGA exposed pad) package; supplier device package listed as 1152‑FBGA (35×35). Surface mount for standard PCB assembly processes.
• Operating Range & Grade  Commercial grade with an operating temperature range of 0°C to 85°C and RoHS compliance for environmental compatibility.

Typical Applications

• High‑density digital processing  Implement algorithmic accelerators and datapath logic using the device’s 242,000 logic elements and embedded RAM.
• I/O‑intensive controllers  Systems requiring extensive external interfacing can leverage up to 544 I/Os for sensors, peripherals, and parallel buses.
• Board‑level commercial products  Commercial electronic devices that require a surface‑mount BGA package and operation across 0°C to 85°C.
• On‑chip buffering and state machines  Leverage approximately 15.47 Mbits of embedded memory for FIFOs, frame buffers, and local state storage without immediate external memory dependencies.

Unique Advantages

• High logic density: 242,000 logic elements enable large, integrated designs and parallel architectures on a single FPGA.
• Substantial embedded memory: Approximately 15.47 Mbits of RAM reduces reliance on external memory for many buffering and storage needs.
• Broad I/O capability: 544 I/Os provide flexibility for mixed‑signal interfaces, multiple buses, and high‑pin‑count peripherals.
• Compact BGA package: 1152‑BBGA (1152‑FBGA, 35×35) with an exposed pad supports PCB thermal and mechanical integration in surface‑mount designs.
• Low core voltage operation: Narrow core supply range (1.07 V–1.13 V) simplifies power‑rail design and core power budgeting.
• Commercial temperature and RoHS compliant: Rated for 0°C to 85°C operation and RoHS compliance for regulatory alignment in commercial products.

Why Choose 5AGXFA7H4F35C4N?

The 5AGXFA7H4F35C4N Arria V GX FPGA delivers a compelling combination of logic capacity, embedded memory, and high I/O count in a surface‑mount ball‑grid package for commercial applications. As an Intel‑manufactured Arria V GX device, it supports designs that need substantial on‑chip resources and flexible I/O without moving immediately to external memory or larger multi‑chip solutions.

This part is suited for engineers and procurement teams building commercial‑grade systems that require predictable operating parameters (1.07 V–1.13 V core, 0°C–85°C), RoHS compliance, and a compact 1152‑BBGA footprint for PCB integration.

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