5AGXFA7H4F35C5N

The 5AGXFA7H4F35C5N is an Intel Arria V GX field programmable gate array (FPGA) optimized for designs that require high logic capacity and extensive I/O. This device combines substantial on‑chip memory and a large I/O count in a compact FCBGA exposed‑pad package for surface‑mount board integration.

Key device attributes include 242,000 logic elements, approximately 15.47 Mbits of embedded RAM, 544 user I/Os, a 1.07–1.13 V core supply range, and commercial‑grade operation from 0 °C to 85 °C. The device is RoHS compliant and is supplied in a 1152‑FBGA (35 × 35 mm) footprint.

Key Features

• Core Logic Capacity  242,000 logic elements provide a high-density fabric for complex FPGA implementations.
• Embedded Memory  Approximately 15.47 Mbits of on‑chip RAM to support buffering, DSP pipelines, and local data storage.
• I/O Density  544 available I/Os to support high‑pin‑count interfaces, parallel peripherals, and multi‑channel systems.
• Power Supply  Core voltage range of 1.07 V to 1.13 V supports precise supply planning and power budgeting.
• Package & Mounting  1152‑BBGA, FCBGA exposed pad package (supplier package: 1152‑FBGA, 35×35 mm) designed for surface‑mount PCB assembly and thermal return through the exposed pad.
• Operating Grade & Temperature  Commercial grade with operating temperature range of 0 °C to 85 °C for standard commercial applications.
• Regulatory  RoHS compliant for environmental and manufacturing requirements.
• Documentation  Detailed Arria V device datasheet available covering electrical characteristics, switching and configuration specifications, and I/O timing.

Typical Applications

• High‑density digital processing  Use the 242,000 logic elements and embedded RAM to implement large custom datapaths, accelerators, and control logic in compact hardware designs.
• Multi‑interface aggregation  The 544 I/Os enable aggregation of many parallel interfaces or channels for protocol bridging, I/O expansion, and high‑pin‑count connectivity.
• Board‑level integration  Surface‑mount 1152‑FBGA package with an exposed pad supports compact PCB layouts and thermal conduction for tightly integrated systems.
• Embedded system prototyping  Commercial‑grade temperature range and documented electrical/configuration specifications suit evaluation and development of production designs.

Unique Advantages

• High logic density: 242,000 logic elements enable consolidation of multiple functions into a single FPGA, reducing external component count.
• Substantial on‑chip RAM: Approximately 15.47 Mbits of embedded memory supports local buffering and high‑throughput data paths without external memory.
• Extensive I/O capability: 544 I/Os provide flexibility for complex interfacing and parallel signal routing on modern systems.
• Compact, industry‑standard packaging: 1152‑FBGA (35×35 mm) footprint with exposed pad is suitable for dense board designs and thermal management strategies.
• Predictable power envelope: Narrow core voltage range (1.07–1.13 V) simplifies power supply design and margin analysis.
• Compliant and documented: RoHS compliance and a comprehensive device datasheet support regulatory needs and design validation.

Why Choose 5AGXFA7H4F35C5N?

The 5AGXFA7H4F35C5N delivers a combination of high logic capacity, significant embedded RAM, and abundant I/O in a compact surface‑mount FCBGA package. It is well suited for development teams looking to integrate dense digital logic and extensive connectivity into a single FPGA while maintaining commercial operating conditions and RoHS compliance.

As an Intel Arria V GX device with comprehensive datasheet documentation, this FPGA is appropriate for designers who require predictable electrical characteristics, clear configuration specifications, and a platform capable of consolidating complex functions at board level.

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