5AGXFA7H4F35I3

The 5AGXFA7H4F35I3 is an Arria V GX Field Programmable Gate Array (FPGA) provided in an industrial-grade FCBGA package. With 242,000 logic elements and approximately 15.47 Mbits of on-chip RAM, this device targets designs that require high logic density, substantial embedded memory, and a large I/O count.

Engineered for surface-mount deployment, the device operates across a core voltage supply window of 1.12 V to 1.18 V and an industrial temperature range of −40 °C to 100 °C, making it suitable for demanding embedded and industrial applications where long-term reliability and thermal considerations matter.

Key Features

• Logic Capacity  242,000 logic elements provide substantial programmable logic density for complex digital designs and system integration.
• Embedded Memory  Approximately 15.47 Mbits of on-chip RAM to support large buffers, FIFOs, and local data storage without external memory for many use cases.
• I/O Density  544 available I/O pins to support rich peripheral connectivity, parallel interfaces, and multi-channel signal routing.
• Package and Mounting  1152-BBGA, FCBGA with exposed pad; supplier package listed as 1152-FBGA (35×35). Surface-mount mounting type simplifies PCB assembly for compact system boards.
• Power  Core supply specified between 1.12 V and 1.18 V to meet power-rail design targets for the FPGA core.
• Operating Range  Industrial temperature grade with operation from −40 °C to 100 °C for deployment in temperature-challenging environments.
• Compliance  RoHS compliant, supporting regulatory requirements for lead-free assembly.

Typical Applications

• Industrial Control Systems  Use the device where high logic density and broad I/O are needed for real-time control, signal aggregation, and protocol bridging in industrial equipment.
• High-Density Embedded Systems  Suitable for compact embedded platforms that require significant programmable logic and embedded RAM within a single FCBGA package.
• I/O-Rich Interface Modules  Ideal for designs that must consolidate multiple interfaces or handle numerous parallel signals due to its 544 I/O capability.

Unique Advantages

• High Programmable Density: 242,000 logic elements enable complex implementations and system-level consolidation, reducing the need for multiple discrete devices.
• Substantial On-Chip Memory: Approximately 15.47 Mbits of embedded RAM reduces external memory dependence and simplifies board-level design.
• Extensive I/O Resources: 544 I/O pins provide flexibility for diverse peripheral connections and multi-channel designs.
• Industrial Reliability: Rated for −40 °C to 100 °C operation, supporting extended temperature requirements typical of industrial deployments.
• Compact FCBGA Package: The 1152-ball FCBGA with exposed pad delivers a space-efficient solution with considerations for thermal management on the PCB.
• Regulatory Compliance: RoHS compliance supports modern manufacturing and environmental requirements.

Why Choose 5AGXFA7H4F35I3?

The 5AGXFA7H4F35I3 Arria V GX FPGA combines large logic capacity, significant embedded memory, and a high I/O count in an industrial-grade FCBGA package. These attributes make it a strong candidate for engineers looking to consolidate functionality, support complex algorithms, or implement I/O-heavy interfaces on a compact board footprint.

For teams designing industrial or embedded systems that require predictable operating ranges and RoHS-compliant hardware, this device offers a balance of integration and thermal/package considerations aligned with demanding deployment environments.

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