5AGXFA7H4F35I5N

The 5AGXFA7H4F35I5N is an Arria V GX field-programmable gate array (FPGA) IC from Intel, offered in an industrial grade configuration. It provides a high-density programmable logic fabric with substantial embedded memory and a large I/O count, packaged in a 1152-BBGA FCBGA exposed-pad surface-mount format.

This device is designed for designs that require extensive on-chip logic and memory resources combined with broad external interfacing, while supporting industrial temperature ranges and RoHS compliance.

Key Features

• Programmable logic capacity — 242,000 logic elements to implement complex digital systems and custom accelerators.
• Embedded memory — approximately 15.47 Mbits of on-chip RAM for buffers, FIFOs, and local storage.
• High I/O density — 544 I/Os to support multiple interfaces and parallel connectivity.
• Package & mounting — 1152-BBGA, FCBGA exposed pad; supplier device package listed as 1152-FBGA (35×35); surface-mount assembly.
• Power supply — core voltage supply range of 1.07 V to 1.13 V for power budget planning.
• Industrial temperature rating — rated for operation from −40 °C to 100 °C to meet demanding environmental requirements.
• Regulatory status — RoHS compliant.

Typical Applications

• High-density programmable logic and prototyping — Use the 242,000 logic elements and on-chip RAM to implement complex state machines, data paths, or hardware prototypes.
• I/O-rich embedded systems — 544 I/Os enable integration with multiple sensors, interfaces, or parallel buses without extensive external glue logic.
• Industrial control and automation — Industrial-grade temperature range (−40 °C to 100 °C) supports deployment in factory and field equipment.
• On-chip buffering and data handling — Approximately 15.47 Mbits of embedded memory for local storage, packet buffering, and streaming data workflows.

Unique Advantages

• Large on-chip resources: 242,000 logic elements combined with substantial embedded RAM reduce dependency on external CPLDs or memory devices.
• Broad external connectivity: 544 I/Os provide flexibility to connect many peripherals or high-pin-count subsystems directly to the FPGA.
• Industrial reliability: Rated operation from −40 °C to 100 °C supports long-term deployment in temperature-challenging environments.
• Compact, manufacturable package: 1152-BBGA FCBGA exposed pad in a 35×35 footprint supports standard surface-mount production flows.
• Predictable power planning: Narrow core voltage range (1.07 V–1.13 V) assists in designing stable power delivery for the FPGA core.
• RoHS compliant: Conforms to lead-free requirements for environmentally conscious designs.

Why Choose 5AGXFA7H4F35I5N?

The 5AGXFA7H4F35I5N Arria V GX FPGA delivers a balance of high logic capacity, significant embedded memory, and extensive I/O in a compact surface-mount package rated for industrial temperatures. These characteristics make it suitable for engineering teams needing on-chip resources and connectivity without increasing PCB complexity.

For designs that demand large programmable fabrics with reliable environmental performance and RoHS compliance, this FPGA offers a clear specification set that supports predictable power, thermal, and interface planning throughout development and deployment.

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