5AGXFA7H6F35C6G

IC FPGA 544 I/O 1152FBGA
Part Description

Arria V GX Field Programmable Gate Array (FPGA) IC 544 15470592 242000 1152-BBGA, FCBGA

Quantity 1,043 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package1152-FBGA, FC (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1152-BBGA, FCBGANumber of I/O544Voltage1.07 V - 1.13 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs11460Number of Logic Elements/Cells242000
Number of GatesN/AECCNPENDING ECCNHTS Code0000.00.0000
QualificationN/ATotal RAM Bits15470592

Overview of 5AGXFA7H6F35C6G – Arria V GX FPGA, 544 I/O, approximately 15.47 Mbits RAM, 242000 logic elements

The 5AGXFA7H6F35C6G is an Intel Arria V GX Field Programmable Gate Array (FPGA) provided in a 1152-ball BGA package for surface-mount assembly. It delivers a large logic fabric and substantial on-chip memory alongside a high I/O count, suitable for designs that require dense digital resources and broad peripheral connectivity.

With 242,000 logic elements, approximately 15.47 Mbits of embedded RAM and 544 I/O pins, this commercial-grade device targets complex, I/O-intensive applications where integration and deterministic operating conditions matter. The device operates with a core supply range of 1.07 V to 1.13 V and is rated for 0 °C to 85 °C.

Key Features

  • Logic Capacity  242,000 logic elements for implementing extensive digital logic, state machines and custom processing pipelines.
  • Embedded Memory  Approximately 15.47 Mbits of on-chip RAM to support buffering, lookup tables and local storage close to logic.
  • I/O Density  544 user I/O pins provide broad external connectivity for parallel interfaces, GPIO and mixed-signal front ends.
  • Logic Array Blocks  11,460 LABs (logic array blocks) to structure and partition complex designs efficiently within the fabric.
  • Package & Mounting  1152-BBGA (FCBGA) surface-mount package; supplier device package listed as 1152-FBGA, FC (35×35).
  • Power and Voltage  Core voltage supply range specified at 1.07 V to 1.13 V to support stable core operation.
  • Operating Conditions & Grade  Commercial grade device with operating temperature range 0 °C to 85 °C.
  • Regulatory Compliance  RoHS-compliant construction.

Typical Applications

  • High-density digital processing  Large logic capacity and extensive LAB count make the device suitable for complex algorithm implementation and hardware-accelerated processing.
  • Interface-heavy systems  A high I/O count (544 pins) supports designs that require multiple parallel buses, external memory interfaces or many peripheral connections.
  • Embedded memory–centric designs  Approximately 15.47 Mbits of on-chip RAM enables local buffering, frame storage and LUT-based functions without immediate external memory dependence.

Unique Advantages

  • Highly integrated logic fabric: 242,000 logic elements and 11,460 LABs provide the resources to consolidate functions into a single device and reduce system complexity.
  • Significant on-chip memory: Approximately 15.47 Mbits of embedded RAM minimizes external memory traffic and supports data-heavy tasks on-chip.
  • Extensive I/O availability: 544 I/O pins enable broad peripheral connectivity, simplifying board-level routing for multi-interface systems.
  • Production-ready package: 1152-ball BGA, surface-mount construction (35×35 mm package footprint) supports automated assembly in volume manufacturing.
  • Defined operating window: Core voltage range and commercial temperature rating allow predictable operation within standard commercial environments.
  • Environmental compliance: RoHS status ensures adherence to common lead-free manufacturing requirements.

Why Choose 5AGXFA7H6F35C6G?

The 5AGXFA7H6F35C6G Arria V GX FPGA balances high logic density, substantial embedded memory and broad I/O in a compact 1152-ball BGA package. It is suited to engineers designing complex, I/O-rich systems who need consolidated digital resources and clearly specified operating conditions.

As part of the Arria V family from Intel, this device provides a defined set of electrical and configuration specifications for integration into commercial designs where predictable supply and thermal conditions are maintained.

Request a quote or submit a product inquiry to obtain pricing, availability and delivery details for 5AGXFA7H6F35C6G.

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