5AGXFA7H6F35C6N
| Part Description |
Arria V GX Field Programmable Gate Array (FPGA) IC 544 15470592 242000 1152-BBGA, FCBGA Exposed Pad |
|---|---|
| Quantity | 412 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA (35x35) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA Exposed Pad | Number of I/O | 544 | Voltage | 1.07 V - 1.13 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 11460 | Number of Logic Elements/Cells | 242000 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 15470592 |
Overview of 5AGXFA7H6F35C6N – Arria V GX Field Programmable Gate Array (FPGA) IC, 544 I/O, 242000 Logic Elements, 1152-BBGA
The 5AGXFA7H6F35C6N is an Arria V GX field programmable gate array (FPGA) from Intel, presented in a 1152-BBGA, FCBGA exposed pad package. It delivers high on-chip logic and memory capacity with extensive I/O in a commercial-grade, surface-mount form factor.
Key value comes from its combination of 242,000 logic elements, approximately 15.47 Mbits of embedded memory, and 544 I/O pins, together with a narrow core supply voltage range and standard commercial operating temperature.
Key Features
- Core Logic Capacity 242,000 logic elements for implementing complex programmable logic and custom datapaths.
- Embedded Memory Approximately 15.47 Mbits of on-chip RAM to support local buffering, state storage, and memory-intensive logic.
- Programmable I/O 544 I/O pins to support broad interfacing requirements and multi-channel designs.
- Power Supply Core voltage supply specified between 1.07 V and 1.13 V for defined power and timing characteristics.
- Package & Mounting 1152-BBGA, FCBGA exposed pad package; supplier device package listed as 1152-FBGA (35×35). Surface-mount mounting type for standard PCB assembly.
- Grade & Temperature Commercial grade device with an operating temperature range of 0 °C to 85 °C.
- Environmental Compliance RoHS compliant.
Unique Advantages
- High-density integration: Combines 242,000 logic elements with approximately 15.47 Mbits of embedded memory to support complex logic functions and local data storage without immediate need for external memory.
- Wide I/O reach: 544 I/O pins enable extensive peripheral and subsystem interfacing from a single device.
- Compact, board-friendly package: The 1152-BBGA / 1152-FBGA (35×35) footprint with an exposed pad supports dense PCB layouts and board-level assembly.
- Commercial temperature suitability: Specified for 0 °C to 85 °C operation to match common commercial deployment environments.
- Standard SMT assembly compatibility: Surface-mount mounting type aligns with common manufacturing processes.
- Regulatory alignment: RoHS compliance simplifies environmental and regulatory planning.
Why Choose 5AGXFA7H6F35C6N?
The 5AGXFA7H6F35C6N brings significant on-chip resources—242,000 logic elements and roughly 15.47 Mbits of embedded memory—together with 544 I/O in a single, commercial-grade Arria V GX FPGA package. Its defined core voltage window and commercial temperature rating give designers the determinism needed for many board-level implementations.
This part is suited to designs that require substantial logic and memory capacity inside a compact surface-mount BBGA package, and for teams leveraging Intel’s Arria V device documentation and support materials for development and qualification.
Request a quote or submit an inquiry to obtain current pricing and availability for the 5AGXFA7H6F35C6N.

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