5AGXFB1H4F35C5G

The 5AGXFB1H4F35C5G is an Arria V GX field programmable gate array (FPGA) in a commercial-grade surface-mount BGA package. It delivers very large logic capacity and memory resources alongside a high I/O count for complex, custom digital designs.

Key device attributes include approximately 300,000 logic elements, approximately 17.36 Mbits of embedded memory, 544 user I/Os, a core voltage range of 1.07 V to 1.13 V, and a 0 °C to 85 °C operating temperature range. The device is RoHS compliant and supplied in a 1152-ball FBGA package (35 × 35 mm).

Key Features

• Core Logic Density  Approximately 300,000 logic elements provide capacity for large custom FPGA designs and complex state machines.
• Embedded Memory  Approximately 17.36 Mbits of on-chip RAM to support buffering, lookup tables, and embedded data storage within logic designs.
• High I/O Count  544 user I/Os permit extensive external interfacing and parallel connectivity for multi-channel or high-pin-count systems.
• Package & Mounting  1152-ball FBGA (1152-BBGA, FCBGA / 35 × 35 mm) in a surface-mount form factor for board-level integration in compact layouts.
• Power  Core supply specified between 1.07 V and 1.13 V to match system power-rail design requirements.
• Operating Temperature  Rated for 0 °C to 85 °C operation for commercial-environment deployments.
• Regulatory Compliance  RoHS compliant, supporting regulatory and environmental requirements for Pb-free assembly.

Typical Applications

• Complex Digital Systems  Use the large logic element count and embedded memory to implement high-density custom logic, protocol processing, and state machines.
• High‑Pin Connectivity Designs  Leverage 544 I/Os for multi-channel interfaces, parallel sensors, or wide bus connectivity between subsystems.
• Prototyping and System Integration  The surface-mount FBGA package and commercial temperature rating make the device suitable for board-level prototypes and production systems in commercial environments.

Unique Advantages

• Large FPGA Fabric:  Approximately 300,000 logic elements enable substantial on-chip logic integration, reducing the need for external glue logic.
• Significant On‑Chip Memory:  Approximately 17.36 Mbits of RAM supports buffering, FIFOs, and on-chip data handling to simplify system memory architecture.
• Extensive I/O Resources:  544 I/Os provide design flexibility for dense peripheral and interface implementations without external I/O expanders.
• Compact, Manufacturable Package:  1152-ball FBGA (35 × 35 mm) surface-mount package facilitates automated assembly and high-density PCB routing.
• Controlled Core Power Range:  A defined 1.07 V–1.13 V supply window supports predictable power delivery and thermal planning.
• RoHS Compliance:  Meets lead‑free assembly requirements for environmentally conscious product lines.

Why Choose 5AGXFB1H4F35C5G?

The 5AGXFB1H4F35C5G positions itself as a high-capacity Arria V GX FPGA option for commercial applications that require substantial logic density, on-chip memory, and broad I/O capability in a manufacturable FBGA package. Its electrical and environmental ratings support deployment in a wide range of commercial system designs where integration and board-level reliability are priorities.

This device is suitable for engineering teams building complex digital systems that need on-chip resources to reduce external components and streamline board-level integration, with the assurance of documented device specifications and RoHS compliance.

Request a quote or submit a procurement inquiry for 5AGXFB1H4F35C5G to evaluate availability and pricing for your next design.